SLAS611C October   2009  – January 2016 ADS5400

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Interleaving Adjustments
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Configuration
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Analog Input Over-Range Recovery Error
      4. 7.3.4  Clock Inputs
      5. 7.3.5  Over Range
      6. 7.3.6  Data Scramble
      7. 7.3.7  Test Patterns
      8. 7.3.8  Die Identification and Revision
      9. 7.3.9  Die Temperature Sensor
      10. 7.3.10 Interleaving
        1. 7.3.10.1 Gain Adjustment
        2. 7.3.10.2 Offset Adjustment
        3. 7.3.10.3 Input Clock Coarse Phase Adjustment
        4. 7.3.10.4 Input Clock Fine Phase Adjustment
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Bus and Clock Options
      2. 7.4.2 Reset and Synchronization
      3. 7.4.3 LVDS
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 Serial Register Map
      2. 7.6.2 Description of Serial Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clocking Source for ADS5400
        2. 8.2.2.2 Amplifier Selection
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 PowerPAD™ Package
      1. 10.3.1 Assembly Process
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage AVDD5 to GND 6 V
AVDD3 to GND 5 V
DVDD3 to GND 5 V
AINP, AINN to GND(2) Voltage difference between pin and ground 0.5 4.5 V
AINP to AINN(2) Voltage difference between pins, common mode at AVDD5/2 Short duration –0.3 (AVDD5 + 0.3) V
Continuous AC signal 1.25 3.75 V
Continuous DC signal 1.75 3.25 V
Pin voltage CLKINP, CLKINN to GND(2) Voltage difference between pin and ground 0.5 4.5 V
CLKINP to CLKINN(2) Voltage difference between pins, common mode at AVDD5/2 Continuous AC signal 1.1 3.9 V
Continuous DC signal 2 3 V
RESETP, RESETN to GND(2) Voltage difference between pin and ground –0.3 (AVDD5 + 0.3) V
RESETP to RESETN(2) Voltage difference between pins Continuous AC signal 1.1 3.9 V
Continuous DC signal 2 3 V
Data/OVR Outputs to GND(2) Voltage difference between pin and ground –0.3 (DVDD3 + 0.3) V
SDENB, SDIO, SCLK to GND(2) –0.3 (AVDD3 + 0.3)
ENA1BUS, ENPWD, ENEXTREF to GND(2) –0.3 (AVDD5 + 0.3)
Temperature Operating –40 85 °C
Maximum junction , TJ 150 °C
Storage, Tstg –65 150 °C
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon request.
(2) Valid when supplies are within recommended operating range.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
SUPPLIES
Analog supply voltage, AVDD5 4.75 5 5.25 V
Analog supply voltage, AVDD3 3.135 3.3 3.465 V
Digital supply voltage, DVDD3 3.135 3.3 3.465 V
ANALOG INPUT
Full-scale differential input range 1.52 2 VPP
VCM Input common mode AVDD5/2 V
DIGITAL OUTPUT
Differential output load 5 pF
CLOCK INPUT
CLK input sample rate (sine wave) 100 1000 MSPS
Clock amplitude, differential 0.6 1.5 VPP
Clock duty cycle 45% 50% 55%
TA Open free-air temperature –40 85 °C

6.4 Thermal Information

THERMAL METRIC(1) ADS5400 UNIT
PZP (HTQFP)
100 PINS
RθJA Junction-to-ambient thermal resistance 34.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 7.4 °C/W
RθJB Junction-to-board thermal resistance 9.1 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Typical values at TA = 25°C, minimum and maximum values over full temperature range TMIN = –40°C to TMAX = 85°C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, –1-dBFS differential input, and 1.5 VPP differential clock (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUTS
Full-scale differential input range Programmable 1.52 2 VPP
VCM Common-mode input Self-biased to AVDD5 / 2 AVDD5/2 V
RIN Input resistance, differential (DC) 85 100 115 Ω
CIN Input capacitance Estimated to ground from each AIN pin, excluding soldered package 0.8 pF
CMRR Common-mode rejection ratio Common mode signal = 125 MHz 40 dB
INTERNAL REFERENCE VOLTAGE
VREF Reference voltage 2 V
DYNAMIC ACCURACY
Resolution No missing codes 12 Bits
DNL Differential linearity error fIN = 125 MHz –1 ±0.7 2 LSB
INL Integral non- linearity error fIN = 125 MHz –4 ±2 4.5 LSB
Offset error default is trimmed near 0 mV –2.5 0 2.5 mV
Offset temperature coefficient 0.02 mV /°C
Gain error –5 5 % full scale
Gain temperature coefficient 0.03 % full scale /°C
POWER SUPPLY(1)
I(AVDD5) 5-V analog supply current (Bus A and B active) fIN = 125 MHz,
fS = 1 GSPS		 220 234 mA
5-V analog supply current (Bus A active) fIN = 125 MHz,
fS = 1 GSPS		 225 241 mA
I(AVDD3) 3.3-V analog supply current (Bus A and B active) fIN = 125 MHz,
fS = 1 GSPS		 219 234 mA
3.3-V analog supply current (Bus A active) fIN = 125 MHz,
fS = 1 GSPS		 226 242 mA
I(DVDD3) 3.3-V digital supply current
(Bus A and B active)		 fIN = 125 MHz,
fS = 1 GSPS		 136 154 mA
3.3-V digital supply current
(Bus A active)		 fIN = 125 MHz,
fS = 1 GSPS		 71 81 mA
Total power dissipation
(BUS A and B active)		 fIN = 125 MHz,
fS = 1 GSPS		 2.28 2.45 W
Total power dissipation
(Bus A active)		 fIN = 125 MHz,
fS = 1 GSPS		 2.15 2.25 W
Total power dissipation ENPWD = logic High (sleep enabled) 13 50 mW
Wake-up time from sleep 1.8 ms
PSRR Power-supply rejection ratio 1MHz injected to each supply, measured without external decoupling 50 dB
DYNAMIC AC CHARACTERISTICS
SNR Signal-to-noise ratio fIN = 125 MHz 57 58.5 dBFS
fIN = 600 MHz 56.5 58.2
fIN = 850 MHz 56 57.8
fIN = 1200 MHz 57.6
fIN = 1700 MHz 55.7
SFDR Spurious-free dynamic range fIN = 125 MHz 65 75 dBc
fIN = 600 MHz 63 72
fIN = 850 MHz 60 71
fIN = 1200 MHz 66
fIN = 1700 MHz 56
HD2 Second harmonic fIN = 125 MHz 65 78 dBc
fIN = 600 MHz 63 78
fIN = 850 MHz 60 71
fIN = 1200 MHz 66
fIN = 1700 MHz 56
HD3 Third harmonic fIN = 125 MHz 65 80 dBc
fIN = 600 MHz 63 72
fIN = 850 MHz 60 72
fIN = 1200 MHz 70
fIN = 1700 MHz 65
Worst harmonic/spur (other than HD2 and HD3) fIN = 125 MHz 65 80 dBc
fIN = 600 MHz 63 72
fIN = 850 MHz 60 72
fIN = 1200 MHz 66
fIN = 1700 MHz 64
THD Total Harmonic Distortion fIN = 125 MHz 63 71.7 dBc
fIN = 600 MHz 62 67
fIN = 850 MHz 59 66.5
fIN = 1200 MHz 65.1
fIN = 1700 MHz 55.7
SINAD Signal-to-noise and distortion fIN = 125 MHz 56 58.5 dBFS
fIN = 600 MHz 55 58.2
fIN = 850 MHz 54 57.8
fIN = 1200 MHz 57.5
fIN = 1700 MHz 54.2
Two-tone SFDR fIN1 = 247.5 MHz, fIN2 = 252.5 MHz, each tone at –7 dBFS 74.6 dBFS
fIN1 = 247.5 MHz, fIN2 = 252.5 MHz, each tone at –11 dBFS 80.4
fIN1 = 1197.5 MHz, fIN2 = 1202.5 MHz, each tone at –7 dBFS 70
fIN1 = 1197.5 MHz, fIN2 = 1202.5 MHz, each tone at –11 dBFS 78.3
ENOB Effective number of bits (using SINAD in dBFS) fIN = 125 MHz 9 9.42 Bits
fIN = 600 MHz 8.84 9.37
fIN = 850 MHz 8.67 9.3
RMS idle-channel noise Inputs tied to common-mode 1.41 LSB rms
60.2 dBFS
(1) All power values assume LVDS output current is set to 3.5 mA.

6.6 Interleaving Adjustments

Typical values at TA = 25°C, Minimum and maximum values over full temperature range TMIN = –40°C to TMAX = 85°C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5 VPP differential clock (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET ADJUSTMENTS
Resolution 9 Bits
LSB magnitude At full scale range of 2 VPP 120 µV
DNL Differential linearity error -2.5 2.5 LSB
INL Integral Non-Linearity error -3 3 LSB
Recommended Min Offset Setting From default offset value, to maintain AC performance -8 mV
Recommended Max Offset Setting From default offset value, to maintain AC performance 8 mV
GAIN ADJUSTMENTS
Resolution 12 Bits
LSB magnitude 120 µV
DNL Differential linearity error -4 -2, +1 4 LSB
INL Integral Non-Linearity error -8 -2, +4 8 LSB
Min Gain Setting 1.52 VPP
Max Gain Setting 2 VPP
INPUT CLOCK FINE PHASE ADJUSTMENT
Resolution 6 Bits
LSB magnitude 116 fs
DNL Differential linearity error -2 2.5 LSB
INL Integral Non-Linearity error -2.5 4 LBS
Max Fine Clock Skew setting 7.4 ps
INPUT CLOCK COARSE PHASE ADJUSTMENT
Resolution 5 Bits
LSB magnitude 2.4 ps
DNL Differential linearity error -1 1 LSB
INL Integral Non-Linearity error -1 5 LSB
Max Coarse Clock Skew setting 73 ps

6.7 Timing Requirements

Typical values at TA = 25°C, Minimum and maximum values over full temperature range TMIN = –40°C to TMAX = 85°C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5 VPP differential clock (unless otherwise noted)(1).
MIN NOM MAX UNIT
ta Aperture delay 250 ps
Aperture jitter, rms Uncertainty of sample point due to internal jitter sources 125 fs
Latency Bus A, using Single Bus Mode 7 Cycles
Bus A, using Dual Bus Mode Aligned 7.5
Bus B, using Dual Bus Mode Aligned 8.5
Bus A and B, using Dual Bus Mode Staggered 7.5
LVDS OUTPUT TIMING (DATA, CLKOUT, OVR/SYNCOUT)(2)
tCLK Clock period 1 10 ns
tCLKH Clock pulse duration, high Assuming worst case 45/55 duty cycle 0.45 ns
tCLKL Clock pulse duration, low Assuming worst case 55/45 duty cycle 0.45 ns
tPD-CLKDIV2 Clock propagation delay CLKIN rising to CLKOUT rising in divide by 2 mode 700 1200 1700 ps
tPD-CLKDIV4 Clock propagation delay CLKIN rising to CLKOUT rising in divide by 4 mode 700 1200 1700 ps
tPD-ADATA Bus A data propagation delay CLKIN falling to Data Output transition 700 1400 2100 ps
tPD-BDATA Bus B data propagation delay CLKIN falling to Data Output transition 700 1400 2100 ps
tSU-SBM (3) Setup time, single bus mode Data valid to CLKOUT edge, 50% CLKIN duty cycle 290p (tCLK/2) - 185p s
tH-SBM Hold time, single bus mode CLKOUT edge to Data invalid, 50% CLKIN duty cycle 410p (tCLK/2) - 65p s
tSU-DBM Setup time, dual bus mode Data valid to CLKOUT edge, 50% CLKIN duty cycle 550p tCLK - 425p s
tH-DBM Hold time, dual bus mode CLKOUT edge to Data invalid, 50% CLKIN duty cycle 1150p tCLK + 175p s
tr LVDS rise time Measured 20% to 80% 400 ps
tf LVDS output fall time Measured 20% to 80% 400 ps
LVDS INPUT TIMING (RESETIN)
tRSU RESET setup time RESETP going HIGH to CLKINP going LOW 300 ps
tRH RESET hold time CLKINP going LOW to RESETP going LOW 300 ps
RESET input capacitance Differential 1 pF
RESET input current ±1 µA
SERIAL INTERFACE TIMING
tS-SDENB Setup time, serial enable SDENB falling to SCLK rising 20 ns
tH-SDENB Hold time, serial enable SCLK falling to SENDB rising 25 ns
tS-SDIO Setup time, SDIO SDIO valid to SCLK rising 10 ns
tH-SDIO Hold time, SDIO SCLK rising to SDIO transition 10 ns
fSCLK Frequency 10 MHz
tSCLK SCLK period 100 ns
tSCLKH Minimum SCLK high time 40 ns
tSCLKL Minimum SCLK low time 40 ns
tr Rise time 10 pF 10 ns
tf Fall time 10 pF 10 ns
tDDATA Data output delay Data output (SDO/SDIO) delay after SCLK falling, 10-pF load 75 ns
(1) Timing parameters are specified by design or characterization, but not production tested.
(2) LVDS output timing measured with a differential 100-Ω load placed ~4 inches from the ADS5400. Measured differential load capacitance is 3.5 pF. Measurement probes and other parasitics add ~1 pF. Total approximate capacitive load is 4.5 pF differential. All timing parameters are relative to the device pins, with the loading as stated.
(3) In single bus mode at 1 GSPS (1-ns clock), the minimum output setup/hold times over process and temperature provide a minimum 700 ps of data valid window, with 300 ps of uncertainity.

6.8 Switching Characteristics

Typical values at TA = 25°C, Minimum and maximum values over full temperature range TMIN = –40°C to TMAX = 85°C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5 VPP differential clock (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LVDS DIGITAL OUTPUTS (DATA, OVR/SYNCOUT, CLKOUT)
VOD Differential output voltage (±) Terminated 100 Ω differential 247 350 454 mV
VOC Common mode output voltage Terminated 100 Ω differential 1.125 1.25 1.375 V
LVDS DIGITAL INPUTS (RESET)
VID Differential input voltage (±) Each input pin 175 350 mV
VIC Common mode input voltage Each input pin 0.1 1.25 2.4 V
RIN Input resistance 85 100 115 Ω
CIN Input capacitance Each pin to ground 0.6 pF
DIGITAL INPUTS (SCLK, SDIO, SDENB)
VIH High level input voltage 2 AVDD3 + 0.3 V
VIL Low level input voltage 0 0.8 V
IIH High level input current ±1 μA
IIL Low level input current ±1 μA
CIN Input capacitance 2 pF
DIGITAL INPUTS ( ENEXTREF, ENPWD, ENA1BUS)
VIH High level input voltage 2 AVDD5 + 0.3 V
VIL Low level input voltage 0 0.8 V
IIH High level input current ~40-kΩ internal pulldown 125 μA
IIL Low level input current ~40-kΩ internal pulldown 20 μA
CIN Input capacitance 2 pF
DIGITAL OUTPUTS (SDIO, SDO)
VOH High level output voltage IOH = 250 µA 2.8 V
VOL Low level output voltage IOL = 250 µA 0.4 V
CLOCK INPUTS
RIN Differential input resistance CLKINP, CLKINN 130 160 190 Ω
CIN Input capacitance Estimated to ground from each CLKIN pin, excluding soldered packaged 0.8 pF
ADS5400 single_bus_las611.gif
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/2, and should be an even divisor of CLKIN, to keep the CLKOUT phase the same with each RESET event. SYNCOUTA transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit. Bus B is not active in single bus mode.
Figure 1. Single Bus Mode
ADS5400 dual_bus_alig_las611.gif
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/2, and should be an even divisor of CLKIN, to keep the CLKOUT phase the same with each RESET event. SYNCOUTB transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit.
Figure 2. Dual Bus Mode - Aligned, CLKOUT Divide By 2
ADS5400 dual_bus_stg_las611.gif
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/2, and should be an even divisor of CLKIN, to keep the CLKOUT phase the same with each RESET event. SYNCOUTB transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit.
Figure 3. Dual Bus Mode - Staggered, CLKOUT Divide By 2
ADS5400 sing_bus4_las611.gif
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/4, and should be an even divisor of CLKIN, to keep the CLKOUT phase the same with each RESET event. SYNCOUTB transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit.
Figure 4. Dual Bus Mode - Aligned, CLKOUT Divide By 4
ADS5400 dual_stg4_las611.gif
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/4, and should be an even divisor of CLKIN, to keep the CLKOUT phase the same with each RESET event. SYNCOUTB transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit.
Figure 5. Dual Bus Mode - Staggered, CLKOUT Divide By 4

6.9 Typical Characteristics

Typical plots at TA = 25°C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5-VPP differential clock, (unless otherwise noted)
ADS5400 G001_LAS611.gif Figure 6. Spectral Performance FFT for 250-MHz Input Signal
ADS5400 G003_LAS611.gif Figure 8. Spectral Performance FFT for 1.3-GHz Input Signal
ADS5400 G005_LAS611.gif Figure 10. Differential Nonlinearity
ADS5400 G007_LAS611.gif Figure 12. AC Performance vs Input Amplitude
(801.13-MHz Input Signal)
ADS5400 G020_LAS611.gif Figure 14. AC Performance vs Input Amplitude
(747.5-MHz and 752.5-MHz Two-Tone Input Signal)
ADS5400 G008_LAS611.gif Figure 16. SFDR vs AVDD5 Across Temperature
ADS5400 G010_LAS611.gif Figure 18. SFDR vs AVDD3 Across Temperature
ADS5400 G012_LAS611.gif Figure 20. SFDR vs DVDD3 Across Temperature
ADS5400 M0048-30_LAS611.gif Figure 22. SNR vs Input Frequency and Sampling Frequency
ADS5400 G018_LAS611.gif Figure 24. Normalized Gain Response vs Input Frequency
ADS5400 G002_LAS611.gif Figure 7. Spectral Performance FFT for 0.9-GHz Input Signal
ADS5400 G004_LAS611.gif Figure 9. Spectral Performance FFT for 1.7-GHz Input Signal
ADS5400 G006_LAS611.gif Figure 11. Integral Nonlinearity
ADS5400 G019_LAS611.gif Figure 13. AC Performance vs Input Amplitude
(247.5-MHz and 252.5-MHz Two-Tone Input Signal)
ADS5400 G021_LAS611.gif Figure 15. AC Performance vs Input Amplitude
(1197.5-MHz and 1202.5-MHz Two-Tone Input Signal)
ADS5400 G009_LAS611.gif Figure 17. SNR vs AVDD5 Across Temperature
ADS5400 G011_LAS611.gif Figure 19. SNR vs AVDD3 Across Temperature
ADS5400 G013_LAS611.gif Figure 21. SNR vs DVDD3 Across Temperature
ADS5400 M0049-30_LAS611.gif Figure 23. SFDR vs Input Frequency and Sampling Frequency