SLASF21 December   2022 AFE78101 , AFE88101

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: VOUT DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Reference
    11. 6.11 Typical Characteristics: Power Supply
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 7.3.1.1 DAC Resistor String
        2. 7.3.1.2 DAC Buffer Amplifier
        3. 7.3.1.3 DAC Transfer Function
        4. 7.3.1.4 DAC Gain and Offset Calibration
        5. 7.3.1.5 Programmable Slew Rate
        6. 7.3.1.6 DAC Register Structure and CLEAR State
      2. 7.3.2 Analog-to-Digital Converter (ADC) Overview
        1. 7.3.2.1 ADC Operation
        2. 7.3.2.2 ADC Custom Channel Sequencer
        3. 7.3.2.3 ADC Synchronization
        4. 7.3.2.4 ADC Offset Calibration
        5. 7.3.2.5 External Monitoring Inputs
        6. 7.3.2.6 Temperature Sensor
        7. 7.3.2.7 Self-Diagnostic Multiplexer
        8. 7.3.2.8 ADC Bypass
      3. 7.3.3 Programmable Out-of-Range Alarms
        1. 7.3.3.1 Alarm Action Configuration Register
        2. 7.3.3.2 Alarm Voltage Generator
        3. 7.3.3.3 Temperature Sensor Alarm Function
        4. 7.3.3.4 Internal Reference Alarm Function
        5. 7.3.3.5 ADC Alarm Function
        6. 7.3.3.6 Fault Detection
      4. 7.3.4 IRQ
      5. 7.3.5 Internal Reference
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 One-Time Programmable (OTP) Memory
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Power-Down Mode
      2. 7.4.2 Reset
    5. 7.5 Programming
      1. 7.5.1 Communication Setup
        1. 7.5.1.1 SPI Mode
        2. 7.5.1.2 UART Mode
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Frame Definition
        2. 7.5.2.2 SPI Read and Write
        3. 7.5.2.3 Frame Error Checking
        4. 7.5.2.4 Synchronization
      3. 7.5.3 UART
        1. 7.5.3.1 UART Break Mode (UBM)
      4. 7.5.4 Status Bits
      5. 7.5.5 Watchdog Timer
    6. 7.6 Register Maps
      1. 7.6.1 AFEx8101 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multichannel Configuration
    2. 8.2 Typical Application
      1. 8.2.1 4-mA to 20-mA Current Transmitter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Start-Up Circuit
          2. 8.2.1.2.2 Current Loop Control
          3. 8.2.1.2.3 Input Protection and Rectification
          4. 8.2.1.2.4 System Current Budget
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

all input signals are specified with tR = tF = 1 ns/V and timed from a voltage level of (VIL + VIH) / 2, 2.7 V ≤ PVDD ≤ 5.5 V,
VIH = 1.62 V, VIL = 0.15 V, VREFIO = 1.25 V, and TA = –40°C to +125°C (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
SERIAL INTERFACE - WRITE AND READ OPERATION
fSCLK Serial clock frequency 12.5 MHz
tSCLKHIGH SCLK high time 36 ns
tSCLKLOW SCLK low time 36 ns
tCSHIGH CS high time 80 ns
tCSS CS to SCLK falling edge setup time 30 ns
tCSH SCLK falling edge to CS rising edge 30 ns
tCSRI CS rising edge to SCLK falling edge ignore 30 ns
tCSFI SCLK falling edge ignore to CS falling edge 5 ns
tSDIS SDI setup time 5 ns
tSDIH SDI hold time 5 ns
tSDOZD CS falling edge to SDO tri-state condition to driven 40 ns
tSDODZ CS rising edge to SDO driven to tri-state condition 40 ns
tSDODLY SCLK to SDO output delay 40 ns
UART
tBAUD Baud rate = 9600 ± 1% 104 µs
DIGITAL LOGIC
tDACWAIT Sequential DAC update wait time 2.1 µs
tPOR POR reset delay 100 µs
tRESET RESET pulse duration 100 ns
tRESETWAIT Wait time after RESET pulse 10 µs