SLLS104M December   1990  – October 2023 AM26C32 , AM26C32C , AM26C32M

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ±7-V Common-Mode Range With ±200-mV Sensitivity
      2. 7.3.2 Input Fail-Safe Circuitry
      3. 7.3.3 Active-High and Active-Low
      4. 7.3.4 Operates from a Single 5-V Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|16
  • PW|16
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The AM26C32 device is a quadruple differential line receiver for balanced or unbalanced digital data transmission. The enable function is common to all four receivers and offers a choice of active-high or active-low input. The 3-state outputs permit connection directly to a bus-organized system. Fail-safe design specifies that if the inputs are open, the outputs always are high. The AM26C32 devices are manufactured using a BiCMOS process, which is a combination of bipolar and CMOS transistors. This process provides the high voltage and current of bipolar with the low power of CMOS to reduce the power consumption to about one-fifth that of the standard AM26LS32, while maintaining AC and DC performance.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
AM26C32 PDIP (N, 16) 19.3 mm × 9.4 mm
SO (NS, 16) 10.2 mm × 7.8 mm
SOIC (D, 16) 9.9 mm × 6 mm
SSOP (DB, 16) 6.2mm × 7.8mm
TSSOP (PW, 16) 5 mm × 6.4 mm
CDIP (J, 16) mm × 6.92 mm
CFP (W, 16) 10.3 mm × 6.73 mm
LCCC (FK, 20) 8.90 mm × 8.90 mm
For more Information, see Section 11.
The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-82F476A9-12A6-4F0B-8145-6B5F0948A0BC-low.gif Simplified Schematic