SPRSP98 November   2023 AM625SIP

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
    1. 3.1 Functional Block Diagram
  5. Device Comparison
    1. 4.1 Related Products
  6. Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMK|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Operating Performance Points

This section describes maximum operating conditions of the device in Table 6-1 and describes each Operating Performance Point (OPP) for processor clocks and device core clocks in Table 6-2.

Table 6-1 Device Speed Grades
Speed
Grade
VDD_CORE
(V)(1)
MAXIMUM OPERATING FREQUENCY (MHz) MAXIMUM
TRANSITION
RATE (MT/s)
A53SS
(Cortex-A53x)
GPU PRU Main
Infra
(CBA)
MCUSS
(Cortex-M4F)
Device/
Power
Manager
(Cortex-R5F)
SMS
Subsystem
(Dual
Cortex-M4F)
OCSRAM LPDDR4
T 0.75/0.85 1250 500 333 250 400 400 400 400 1600
0.85 1400
Nominal operating voltage, see Recommended Operating Conditions.
Table 6-2 Device Operating Performance Points
OPP A53SS(1) FIXED OPERATING FREQUENCY OPTIONS (MHz)(2) MT/s
GPU PRU MAIN
INFRA (CBA)
MCUSS DEVICE/
POWER
MANAGER
SMS /
SMS CBA
OCSRAM LPDDR4

High
From
ARM0
PLL
Bypass
to
Speed
Grade
Maximum
500 333,
250,
or
200
250 400
or
200
400 400 400 From
DDR
PLL
Bypass(3)
to
1600
Low N/A 125 133 133 133
Default operating frequency, set by software at boot. Supports Dynamic Frequency Scaling after boot.
Fixed operating frequency, set by software at boot.
The DDR PLL output, which sources DDR0_CK0 and DDR0_CK0_n, is typically defined in units of frequency. So the "DDR PLL Bypass" transaction rate is equal to 2x the DDR PLL output frequency when operating in bypass mode.