SPRSP98 November   2023 AM625SIP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
    1. 4.1 Related Products
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes and Signal Descriptions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Operating Performance Points
    5. 6.5 Thermal Resistance Characteristics
      1. 6.5.1 Thermal Resistance Characteristics for AMK Package
    6. 6.6 Timing and Switching Characteristics
      1. 6.6.1 Power Supply Requirements
        1. 6.6.1.1 Power Supply Sequencing
  8. 7 Applications, Implementation, and Layout
    1. 7.1 Peripheral- and Interface-Specific Design Information
      1. 7.1.1 Integrated LPDDR4 SDRAM Information
  9. 8 Device and Documentation Support
    1. 8.1 Device Nomenclature
      1. 8.1.1 Standard Package Symbolization
      2. 8.1.2 Device Naming Convention
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AMK|425
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.2 Device Naming Convention

FIELD PARAMETER FIELD DESCRIPTION VALUE DESCRIPTION
a Device evolution stage X Prototype
P Preproduction (production test flow, no reliability data)
BLANK(1) Production
– Part Number Prefix AM Not symbolized
BBBB Base production part number 6254 See Table 4-1, Device Comparison
r Device revision A SR1.0
Z Device Speed Grade T See Table 6-1, Device Speed Grades
f Features
(see Table 4-1)		 L Feature code "C" AM6254 device with Integrated 512MB LPDDR4 SDRAM
Y Security / Functional Safety G Non-secure / No Functional Safety
1 to 9 Secure with Dummy Key / No Functional Safety
H to R Secure with Production Key / No Functional Safety
t Temperature(2) J –40°C to 95°C - Industrial (see Section 6.3, Recommended Operation Conditions)
GUID-20231006-SS0I-ZPQD-8ZBN-SNNG6MRBSXXQ-low.svg 2D Barcode Varies Optional 2D barcode, provides additional device information
BLANK
xxxxxxx Lot Trace Code (LTC)
YYY Production Code, For TI use only
ZZZ Production Code, For TI use only
PPP Package Designator AMK FCCSP BGA (425-pin)
dd Pre-Production Code, For TI use only
● Pin one designator
(1) BLANK in the symbol or part number is collapsed so there are no gaps between characters.
(2) Applies to device max junction temperature.