SBASAY9 October   2025 AMC0306M05-Q1

PRODMIX  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (D Package)
    5. 6.5  Thermal Information (DWV Package)
    6. 6.6  Power Ratings 
    7. 6.7  Insulation Specifications (Basic Isolation)
    8. 6.8  Insulation Specifications (Reinforced Isolation)
    9. 6.9  Safety-Related Certifications (Basic Isolation)
    10. 6.10 Safety-Related Certifications (Reinforced Isolation)
    11. 6.11 Safety Limiting Values (D Package)
    12. 6.12 Safety Limiting Values (DWV Package)
    13. 6.13 Electrical Characteristics
    14. 6.14 Switching Characteristics
    15. 6.15 Timing Diagrams
    16. 6.16 Insulation Characteristics Curves
    17. 6.17 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Digital Output
        1. 7.3.4.1 Output Behavior in Case of a Full-Scale Input
        2. 7.3.4.2 Output Behavior in Case of a Missing High-Side Supply
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Bitstream Filtering
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWV|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Input Filter Design

Place a differential RC filter (R1, R2, C5) in front of the device to improve signal-to-noise performance of the signal path. Input noise with a frequency close to the ΔΣ modulator sampling frequency (typically 20MHz) is folded back into the low-frequency range by the modulator. The purpose of the RC filter at the input is to attenuate high-frequency noise below the desired noise level of the measurement. Design the input filter such that:

  • The filter capacitance (C5) is a minimum of 10nF
  • The cutoff frequency of the filter is at least one order of magnitude lower than the sampling frequency (fCLKIN) of the ΔΣ modulator
  • The dynamic input bias current does not generate a significant voltage drop across the DC impedances (R1, R2) relative to the common-mode input voltage range
  • The impedances measured from the analog inputs are equal (R1 equals R2)

Place capacitors C6 and C7 to improve common-mode rejection at high frequencies (>1MHz) and to improve offset voltage performance. For best performance, verify C6 matches the value of C7 and that both capacitors are 10 to 20 times lower in value than C5. NP0-type capacitors offer low temperature drift and low voltage coefficients, and are preferred for common-mode filtering.

For most applications, the structure shown in Figure 8-2 achieves excellent performance.

AMC0206M05-Q1 AMC0306M05-Q1 Input Filter Figure 8-2 Input Filter