SBASAQ4A june   2023  – august 2023 AMC3311-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Timing Diagram
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Isolation Channel Signal Transmission
      3. 7.3.3 Analog Output
      4. 7.3.4 Isolated DC/DC Converter
      5. 7.3.5 Diagnostic Output and Fail-Safe Behavior
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filter Design
        2. 8.2.2.2 Differential to Single-Ended Output Conversion
      3. 8.2.3 Application Curve
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20230112-SS0I-VSBG-J0KT-NJVZPV9NDJW3-low.svg Figure 5-1 DWE Package,16-Pin SOIC(Top View)
Table 5-1 Pin Functions
PINTYPEDESCRIPTION
NO.NAME
1DCDC_OUTPowerHigh-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2DCDC_HGNDPower groundHigh-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin.
3HLDO_INPowerInput of the high-side low-dropout (LDO) regulator; connect this pin to the DCDC_OUT pin.(1)
4NC—No internal connection. Connect this pin to the high-side ground or leave this pin unconnected (floating).
5HLDO_OUTPowerOutput of the high-side LDO.(1)
6INAnalog inputAnalog input.
7, 8HGNDSignal groundHigh-side analog ground; connect both pins to the DCDC_HGND pin.
9GNDSignal groundLow-side analog ground; connect this pin to the DCDC_GND pin.
10OUTNAnalog outputInverting analog output.
11OUTPAnalog outputNoninverting analog output.
12VDDPowerLow-side power supply.(1)
13LDO_OUTPowerOutput of the low-side LDO; connect this pin to the DCDC_IN pin.(1)
14DIAGDigital outputActive-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15DCDC_GNDPower groundLow-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin.
16DCDC_INPowerLow-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.