SWRS222B December   2018  – April 2020 AWR1843

PRODUCTION DATA.  

  1. Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-3 PAD IO Register Bit Descriptions
    3. 4.3 Signal Descriptions
      1. Table 4-4 Signal Descriptions - Digital
      2. Table 4-5 Signal Descriptions - Analog
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Power Supply Specifications
    6. 5.6  Power Consumption Summary
    7. 5.7  RF Specification
    8. 5.8  CPU Specifications
    9. 5.9  Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    10. 5.10 Timing and Switching Characteristics
      1. 5.10.1  Power Supply Sequencing and Reset Timing
      2. 5.10.2  Input Clocks and Oscillators
        1. 5.10.2.1 Clock Specifications
      3. 5.10.3  Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.10.3.1 Peripheral Description
        2. 5.10.3.2 MibSPI Transmit and Receive RAM Organization
          1. Table 5-7 SPI Timing Conditions
          2. Table 5-8 SPI Master Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)
          3. Table 5-9 SPI Master Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)
        3. 5.10.3.3 SPI Slave Mode I/O Timings
          1. Table 5-10 SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        4. 5.10.3.4 Typical Interface Protocol Diagram (Slave Mode)
      4. 5.10.4  LVDS Interface Configuration
        1. 5.10.4.1 LVDS Interface Timings
      5. 5.10.5  General-Purpose Input/Output
        1. Table 5-12 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      6. 5.10.6  Controller Area Network Interface (DCAN)
        1. Table 5-13 Dynamic Characteristics for the DCANx TX and RX Pins
      7. 5.10.7  Controller Area Network - Flexible Data-rate (CAN-FD)
        1. Table 5-14 Dynamic Characteristics for the CANx TX and RX Pins
      8. 5.10.8  Serial Communication Interface (SCI)
        1. Table 5-15 SCI Timing Requirements
      9. 5.10.9  Inter-Integrated Circuit Interface (I2C)
        1. Table 5-16 I2C Timing Requirements
      10. 5.10.10 Quad Serial Peripheral Interface (QSPI)
        1. Table 5-17 QSPI Timing Conditions
        2. Table 5-18 Timing Requirements for QSPI Input (Read) Timings
        3. Table 5-19 QSPI Switching Characteristics
      11. 5.10.11 ETM Trace Interface
        1. Table 5-20 ETMTRACE Timing Conditions
        2. Table 5-21 ETM TRACE Switching Characteristics
      12. 5.10.12 Data Modification Module (DMM)
        1. Table 5-22 DMM Timing Requirements
      13. 5.10.13 JTAG Interface
        1. Table 5-23 JTAG Timing Conditions
        2. Table 5-24 Timing Requirements for IEEE 1149.1 JTAG
        3. Table 5-25 Switching Characteristics Over Recommended Operating Conditions for IEEE 1149.1 JTAG
  6. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Subsystems
      1. 6.3.1 RF and Analog Subsystem
        1. 6.3.1.1 Clock Subsystem
        2. 6.3.1.2 Transmit Subsystem
        3. 6.3.1.3 Receive Subsystem
      2. 6.3.2 Processor Subsystem
      3. 6.3.3 Automotive Interface
      4. 6.3.4 Master Subsystem Cortex-R4F Memory Map
      5. 6.3.5 DSP Subsystem Memory Map
    4. 6.4 Other Subsystems
      1. 6.4.1 ADC Channels (Service) for User Application
        1. Table 6-3 GP-ADC Parameter
  7. Monitoring and Diagnostics
    1. 7.1 Monitoring and Diagnostic Mechanisms
      1. 7.1.1 Error Signaling Module
  8. Applications, Implementation, and Layout
    1. 8.1 Application Information
    2. 8.2 Short- and Medium-Range Radar
    3. 8.3 Reference Schematic
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Stackup Details
  9. Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Comparison

FUNCTION AWR1243 AWR1443 AWR1642 AWR1843
Number of receivers 4 4 4 4
Number of transmitters 3 3 2 3(1)
On-chip memory 576KB 1.5MB 2MB
ASIL B-Targeted B-Targeted B-Targeted
Max I/F (Intermediate Frequency) (MHz) 15 5 5 10
Max real sampling rate (Msps) 37.5 12.5 12.5 25
Max complex sampling rate (Msps) 18.75 6.25 6.25 12.5
Processor
MCU (R4F) Yes Yes Yes
DSP (C674x) Yes Yes
Peripherals
Serial Peripheral Interface (SPI) ports 1 1 2 2
Quad Serial Peripheral Interface (QSPI) Yes Yes Yes
Inter-Integrated Circuit (I2C) interface 1 1 1
Controller Area Network (DCAN) interface Yes Yes Yes
CAN FD Yes Yes
Trace Yes Yes
PWM Yes Yes
Hardware In Loop (HIL/DMM) Yes Yes
GPADC Yes Yes Yes
LVDS/Debug Yes Yes Yes Yes
CSI2 Yes
Hardware accelerator Yes Yes
1-V bypass mode Yes Yes Yes Yes
Cascade (20-GHz sync)
JTAG Yes Yes Yes
Number of Tx that can be simultaneously used 2 2 2 3
Per chirp configurable Tx phase shifter Yes
Product status(2) PRODUCT PREVIEW (PP),
ADVANCE INFORMATION (AI),
or PRODUCTION DATA (PD)
PD PD PD PD
3 Tx Simultaneous operation is supported only in AWR1843 with 1V LDO bypass and PA LDO disable mode. In this mode 1V supply needs to be fed on the VOUT PA pin.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
ADVANCE INFORMATION concerns new products in the sampling or preproduction phase of development. Characteristic data and other specifications are subject to change without notice.