SLUSCG4 May   2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Power On
      3. 7.3.3 Power-Path Management
        1. 7.3.3.1 Input Source Connected - Adapter or USB
          1. 7.3.3.1.1 Input Voltage Dynamic Power Management, (VIN_DPM)
          2. 7.3.3.1.2 Dynamic Power Path Management (DPPM)
          3. 7.3.3.1.3 Battery Supplement Mode
        2. 7.3.3.2 Input Source not Connected
      4. 7.3.4 Thermal Regulation and Thermal Shutdown
      5. 7.3.5 Battery Pack Temperature Monitoring
        1. 7.3.5.1 Modifying and Extending the Allowable Temperature Range for Charging
    4. 7.4 Device Functional Modes
      1. 7.4.1 Battery Charging
        1. 7.4.1.1 Charge Current Translator
        2. 7.4.1.2 Battery Detection and Recharge
        3. 7.4.1.3 Adjustable Termination Threshold (ITERM Input)
        4. 7.4.1.4 Dynamic Charge Timers (TMR Input)
        5. 7.4.1.5 Status Indicators (PGOOD, CHG)
          1. 7.4.1.5.1 Timer Fault
      2. 7.4.2 Explanation of Deglitch Times and Comparator Hysteresis
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Calculations
          1. 8.2.2.1.1 Program The Fast-Charge Current (ISET):
          2. 8.2.2.1.2 Program The Input Current Limit (ILIM)
          3. 8.2.2.1.3 Program The Termination Current Threshold (ITERM, bq24232HA)
          4. 8.2.2.1.4 Program 7.5-hour Fast-Charge Safety Timer (TMR)
        2. 8.2.2.2 TS Function
        3. 8.2.2.3 CHG and PGOOD
        4. 8.2.2.4 Selecting IN, OUT, and BAT Pin Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Requirements for OUT Output
    2. 9.2 USB Sources and Standard AC Adapters
    3. 9.3 Half-Wave Adapters
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

Application report QFN/SON PCB Attachment, SLUA271

11.3 Trademarks

Bluetooth is a trademark of Bluetooth SIG, Inc..

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.