SLUSAK9B September   2011  – April 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Adapter Detect and ACOK Output
      2. 9.3.2  Adapter Overvoltage (ACOVP)
      3. 9.3.3  System Power Selection
      4. 9.3.4  Automatic Internal Soft-Start Charger Current
      5. 9.3.5  Converter Operation
      6. 9.3.6  Input Overcurrent Protection (ACOC)
      7. 9.3.7  Charge Overcurrent Protection (CHGOCP)
      8. 9.3.8  Battery Overvoltage Protection (BATOVP)
      9. 9.3.9  Battery Shorted to Ground (BATLOWV)
      10. 9.3.10 Thermal Shutdown Protection (TSHUT)
      11. 9.3.11 Inductor Short, MOSFET Short Protection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable and Disable Charging
      2. 9.4.2 Continuous Conduction Mode (CCM)
      3. 9.4.3 Discontinuous Conduction Mode (DCM)
    5. 9.5 Programming
      1. 9.5.1 SMBus Interface
      2. 9.5.2 Battery LEARN Cycle
      3. 9.5.3 Charge Time-out
      4. 9.5.4 High-Accuracy Current-Sense Amplifier
      5. 9.5.5 EMI Switching Frequency Adjust
    6. 9.6 Register Maps
      1. 9.6.1 Battery-Charger Commands
      2. 9.6.2 Setting Charger Options
      3. 9.6.3 Charge Options Register [reset = 0x12H]
      4. 9.6.4 Setting the Charge Current
      5. 9.6.5 Setting the Charge Voltage
      6. 9.6.6 Setting Input Current
      7. 9.6.7 Support Turbo Boost Function
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Negative Output Voltage Protection
        2. 10.2.2.2 Reverse Input Voltage Protection
        3. 10.2.2.3 Reduce Battery Quiescent Current
        4. 10.2.2.4 Inductor Selection
        5. 10.2.2.5 Input Capacitor
        6. 10.2.2.6 Output Capacitor
        7. 10.2.2.7 Power MOSFETs Selection
        8. 10.2.2.8 Input Filter Design
        9. 10.2.2.9 bq24735 Design Guideline
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (January 2013) to B Revision

  • Added ESD Ratings table, Overview, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed the format to the new template Go
  • Deleted ", and is available in a 20-pin, 3.5x3.5 mm2 QFN package" from last paragraph in Description section. Added the Device Information table on page 1. Go
  • Added LODRV, HIDRV, and PHASE (2% duty cycle) to the Absolute Maximum Ratings tableGo

Changes from * Revision (September 2011) to A Revision

  • Added V(ESD) specs Go