SLUSBH1C November   2013  – December 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Supply Current
    6. 8.6  Digital Input and Output DC Characteristics
    7. 8.7  LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics
    8. 8.8  LDO Regulator, Wake-up, and Auto-shutdown AC Characteristics
    9. 8.9  ADC (Temperature and Cell Measurement) Characteristics
    10. 8.10 Integrating ADC (Coulomb Counter) Characteristics
    11. 8.11 I2C-Compatible Interface Communication Timing Characteristics
    12. 8.12 SHUTDOWN and WAKE-UP Timing
    13. 8.13 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 Standard Data Commands
      2. 9.5.2 Control(): 0x00 and 0x01
      3. 9.5.3 Extended Data Commands
      4. 9.5.4 Communications
        1. 9.5.4.1 I2C Interface
        2. 9.5.4.2 I2C Time Out
        3. 9.5.4.3 I2C Command Waiting Time
        4. 9.5.4.4 I2C Clock Stretching
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 BAT Voltage Sense Input
        2. 10.2.2.2 Integrated LDO Capacitor
        3. 10.2.2.3 Sense Resistor Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendation
    1. 11.1 Power Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

  • bq27441-G1 Technical Reference Manual (SLUUAC9)
  • bq27441 EVM: System-Side Impedance Track™ Technology User's Guide (SLUUAP4)
  • Quickstart Guide for bq27441-G1 (SLUUAP7)
  • Single Cell Gas Gauge Circuit Design (SLUA456)
  • Key Design Considerations for the bq27500 and bq27501 (SLUA439)
  • Single Cell Impedance Track Printed-Circuit Board Layout Guide (SLUA457)
  • ESD and RF Mitigation in Handheld Battery Electronics (SLUA460)

13.2 Trademarks

Impedance Track is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

13.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.