SLUSAT0E October   2012  – May 2018

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Supply Current
    6. 7.6  Electrical Characteristics: Digital Input and Output DC
    7. 7.7  Electrical Characteristics: Power-On Reset
    8. 7.8  Electrical Characteristics: 2.5-V LDO Regulator
    9. 7.9  Electrical Characteristics: Internal Clock Oscillators
    10. 7.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 7.11 Electrical Characteristics: ADC (Temperature and Cell Voltage)
    12. 7.12 Electrical Characteristics: Data Flash Memory
    13. 7.13 HDQ Communication Timing Characteristics
    14. 7.14 I2C-Compatible Interface Timing Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fuel Gauging
      2. 8.3.2 Impedance Track Variables
        1. 8.3.2.1  Load Mode
        2. 8.3.2.2  Load Select
        3. 8.3.2.3  Reserve Cap-mAh
        4. 8.3.2.4  Reserve Energy
        5. 8.3.2.5  Design Energy Scale
        6. 8.3.2.6  Dsg Current Threshold
        7. 8.3.2.7  Chg Current Threshold
        8. 8.3.2.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
        9. 8.3.2.9  Qmax
        10. 8.3.2.10 Update Status
        11. 8.3.2.11 Avg I Last Run
        12. 8.3.2.12 Avg P Last Run
        13. 8.3.2.13 Delta Voltage
        14. 8.3.2.14 Ra Tables and Ra Filtering Related Parameters
        15. 8.3.2.15 MaxScaleBackGrid
        16. 8.3.2.16 Max DeltaV, Min DeltaV
        17. 8.3.2.17 Qmax Max Delta %
        18. 8.3.2.18 Fast Resistance Scaling
        19. 8.3.2.19 StateOfCharge() Smoothing
        20. 8.3.2.20 DeltaV Max Delta
        21. 8.3.2.21 Lifetime Data Logging Parameters
    4. 8.4 Device Functional Modes
      1. 8.4.1  System Control Function
        1. 8.4.1.1 SHUTDOWN Mode
        2. 8.4.1.2 INTERRUPT Mode
        3. 8.4.1.3 Battery Level Indication
        4. 8.4.1.4 Internal Short Detection
        5. 8.4.1.5 Tab Disconnection Detection
      2. 8.4.2  Temperature Measurement and the TS Input
      3. 8.4.3  Over-Temperature Indication
        1. 8.4.3.1 Over-Temperature: Charge
        2. 8.4.3.2 Over-Temperature: Discharge
      4. 8.4.4  Charging and Charge Termination Indication
        1. 8.4.4.1 Detection Charge Termination
        2. 8.4.4.2 Charge Inhibit
      5. 8.4.5  Power Modes
        1. 8.4.5.1 NORMAL Mode
        2. 8.4.5.2 SLEEP Mode
        3. 8.4.5.3 FULLSLEEP Mode
        4. 8.4.5.4 HIBERNATE Mode
      6. 8.4.6  Power Control
        1. 8.4.6.1 Reset Functions
        2. 8.4.6.2 Wake-Up Comparator
        3. 8.4.6.3 Flash Updates
      7. 8.4.7  Autocalibration
      8. 8.4.8  Communications
        1. 8.4.8.1 Authentication
        2. 8.4.8.2 Key Programming (Data Flash Key)
        3. 8.4.8.3 Key Programming (Secure Memory Key)
        4. 8.4.8.4 Executing An Authentication Query
      9. 8.4.9  HDQ Single-Pin Serial Interface
      10. 8.4.10 HDQ Host Interruption Feature
        1. 8.4.10.1 Low Battery Capacity
        2. 8.4.10.2 Temperature
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Time-Out
        2. 8.5.1.2 I2C Command Waiting Time
        3. 8.5.1.3 I2C Clock Stretching
      2. 8.5.2 Data Commands
        1. 8.5.2.1 Standard Data Commands
          1. 8.5.2.1.1  Control(): 0x00 and 0x01
            1. 8.5.2.1.1.1  CONTROL_STATUS: 0x0000
            2. 8.5.2.1.1.2  DEVICE_TYPE: 0x0001
            3. 8.5.2.1.1.3  FW_VERSION: 0x0002
            4. 8.5.2.1.1.4  HW_VERSION: 0x0003
            5. 8.5.2.1.1.5  RESET_DATA: 0x0005
            6. 8.5.2.1.1.6  PREV_MACWRITE: 0x0007
            7. 8.5.2.1.1.7  CHEM_ID: 0x0008
            8. 8.5.2.1.1.8  BOARD_OFFSET: 0x0009
            9. 8.5.2.1.1.9  CC_OFFSET: 0x000a
            10. 8.5.2.1.1.10 CC_OFFSET_SAVE: 0x000b
            11. 8.5.2.1.1.11 DF_VERSION: 0x000c
            12. 8.5.2.1.1.12 SET_FULLSLEEP: 0x0010
            13. 8.5.2.1.1.13 SET_HIBERNATE: 0x0011
            14. 8.5.2.1.1.14 CLEAR_HIBERNATE: 0x0012
            15. 8.5.2.1.1.15 SET_SHUTDOWN: 0x0013
            16. 8.5.2.1.1.16 CLEAR_SHUTDOWN: 0x0014
            17. 8.5.2.1.1.17 SET_HDQINTEN: 0x0015
            18. 8.5.2.1.1.18 CLEAR_HDQINTEN: 0x0016
            19. 8.5.2.1.1.19 STATIC_CHEM_DF_CHKSUM: 0x0017
            20. 8.5.2.1.1.20 SEALED: 0x0020
            21. 8.5.2.1.1.21 IT ENABLE: 0x0021
            22. 8.5.2.1.1.22 RESET: 0x0041
            23. 8.5.2.1.1.23 EXIT_CAL: 0x0080
            24. 8.5.2.1.1.24 Enter_cal: 0x0081
            25. 8.5.2.1.1.25 OFFSET_CAL: 0x0082
          2. 8.5.2.1.2  AtRate(): 0x02 and 0x03
          3. 8.5.2.1.3  UnfilteredSOC(): 0x04 And 0x05
          4. 8.5.2.1.4  Temperature(): 0x06 And 0x07
          5. 8.5.2.1.5  Voltage(): 0x08 And 0x09
          6. 8.5.2.1.6  Flags(): 0x0a And 0x0b
          7. 8.5.2.1.7  NominalAvailableCapacity(): 0x0c and 0x0d
          8. 8.5.2.1.8  FullAvailableCapacity(): 0x0e and 0x0f
          9. 8.5.2.1.9  RemainingCapacity(): 0x10 and 0x11
          10. 8.5.2.1.10 FullChargeCapacity(): 0x12 and 0x13
          11. 8.5.2.1.11 AverageCurrent(): 0x14 and 0x15
          12. 8.5.2.1.12 TimeToEmpty(): 0x16 And 0x17
          13. 8.5.2.1.13 FilteredFCC(): 0x18 And 0x19
          14. 8.5.2.1.14 StandbyCurrent(): 0x1a And 0x1b
          15. 8.5.2.1.15 UnfilteredFCC(): 0x1c And 0x1d
          16. 8.5.2.1.16 MaxLoadCurrent(): 0x1e And 0x1f
          17. 8.5.2.1.17 UnfilteredRM(): 0x20 And 0x21
          18. 8.5.2.1.18 FilteredRM(): 0x22 And 0x23
          19. 8.5.2.1.19 AveragePower(): 0x24 And 0x25
          20. 8.5.2.1.20 InternalTemperature(): 0x28 And 0x29
          21. 8.5.2.1.21 CycleCount(): 0x2a And 0x2b
          22. 8.5.2.1.22 StateOfCharge(): 0x2c And 0x2d
          23. 8.5.2.1.23 StateOfHealth(): 0x2e And 0x2f
          24. 8.5.2.1.24 PassedCharge(): 0x34 And 0x35
          25. 8.5.2.1.25 Dod0(): 0x36 And 0x37
          26. 8.5.2.1.26 SelfDischargeCurrent(): 0x38 And 0x39
      3. 8.5.3 Extended Data Commands
        1. 8.5.3.1  PackConfig(): 0x3a and 0x3b
        2. 8.5.3.2  DesignCapacity(): 0x3c And 0x3d
        3. 8.5.3.3  DataFlashClass(): 0x3e
        4. 8.5.3.4  DataFlashBlock(): 0x3f
        5. 8.5.3.5  BlockData(): 0x40 Through 0x5f
        6. 8.5.3.6  BlockDataChecksum(): 0x60
        7. 8.5.3.7  BlockDataControl(): 0x61
        8. 8.5.3.8  DeviceNameLength(): 0x62
        9. 8.5.3.9  DeviceName(): 0x63 Through 0x6c
        10. 8.5.3.10 Reserved: 0x6a Through 0x7f
      4. 8.5.4 Data Flash Interface
        1. 8.5.4.1 Accessing the Data Flash
        2. 8.5.4.2 Manufacturer Information Blocks
      5. 8.5.5 Access Modes
      6. 8.5.6 Sealing and Unsealing Data Flash
      7. 8.5.7 Data Flash Summary
    6. 8.6 Register Maps
      1. 8.6.1 Pack Configuration Register
        1. Table 1. Pack Configuration Bit Definition
      2. 8.6.2 Pack Configuration B Register
        1. Table 2. Pack Configuration B Bit Definition
      3. 8.6.3 Pack Configuration C Register
        1. Table 3. Pack Configuration C Bit Definition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT Voltage Sense Input
        2. 9.2.2.2 SRP and SRN Current Sense Inputs
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 TS Temperature Sense Input
        5. 9.2.2.5 Thermistor Selection
        6. 9.2.2.6 REGIN Power Supply Input Filtering
        7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.2.21 Lifetime Data Logging Parameters

The Lifetime Data logging function helps development and diagnosis with the bq27545-G1. IT_ENABLE must be enabled (Command 0x0021) for lifetime data logging functions to be active. bq27545-G1 logs the lifetime data as specified in the Lifetime Data and Lifetime Temp Samples data Flash Subclasses. The data log recordings are controlled by the Lifetime Resolution data flash subclass.

The Lifetime Data Logging can be started by setting the IT_ENABLE bit and setting the Update Time register to a non-zero value.

Once the Lifetime Data Logging function is enabled, the measured values are compared to what is already stored in the data flash. If the measured value is higher than the maximum or lower than the minimum value stored in the data flash by more than the Resolution set for at least one parameter, the entire Data Flash Lifetime Registers are updated after at least LTUpdateTime.

LTUpdateTime sets the minimum update time between DF writes. When a new maximum or minimum is detected, a LT Update window of [update time] second is enabled and the DF writes occur at the end of this window. Any additional max/min value detected within this window will also be updated. The first new maximum or minimum value detected after this window will trigger the next LT Update window.

Internal to bq27545-G1, there exists a RAM maximum or minimum table in addition to the DF maximum or minimum table. The RAM table is updated independent of the resolution parameters. The DF table is updated only if at least one of the RAM parameters exceeds the DF value by more than resolution associated with it. When DF is updated, the entire RAM table is written to DF. Consequently, it is possible to see a new maximum or minimum value for a certain parameter even if the value of this parameter never exceeds the maximum or minimum value stored in the data flash for this parameter value by the resolution amount.

The Life Time Data Logging of one or more parameters can be reset or restarted by writing new default (or starting) values to the corresponding data flash registers through sealed or unsealed access as described below. However, when using unsealed access, new values will only take effect after device reset

The logged data can be accessed as R/W in UNSEALED mode from Lifetime Data Subclass (Subclass ID = 59) of data flash. Lifetime data may be accessed (R/W) when sealed using a process identical Manufacturer Info Block B. The DataFlashBlock command code is 4. Note only the first 32 bytes of lifetime data (not resolution parameters) can be R/W when sealed. See Manufacturer Information Blocks for sealed access. The logging settings such as Temperature Resolution, Voltage Resolution, Current Resolution, and Update Time can be configured only in UNSEALED mode by writing to the Lifetime Resolution Subclass (SubclassID = 66) of the data flash.

The Lifetime resolution registers contain the parameters that set the limits related to how much a data parameter must exceed the previously logged maximum or minimum value to be updated in the lifetime log. For example, V must exceed MaxV by more than Voltage Resolution to update MaxV in the data flash.