SLUSCL5A July   2016  – August 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Dynamic Rectifier Control
      2. 8.3.2  Dynamic Power Scaling
      3. 8.3.3  VO_REG and VIREG Calculations
      4. 8.3.4  RILIM Calculations
      5. 8.3.5  Adapter Enable Functionality
      6. 8.3.6  Turning Off the Transmitter
        1. 8.3.6.1 WPC End Power Transfer (EPT)
        2. 8.3.6.2 PMA EOC
      7. 8.3.7  CM_ILIM
      8. 8.3.8  PD_DET and TMEM
      9. 8.3.9  TS, Both WPC and PMA
      10. 8.3.10 I2C Communication
      11. 8.3.11 Input Overvoltage
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1  Wireless Power Supply Current Register 1 (address = 0x01) [reset = 00000001]
      2. 8.5.2  Wireless Power Supply Current Register 2 (address = 0x02) [reset = 00000111 ]
      3. 8.5.3  I2C Mailbox Register (address = 0xE0) [reset = 10000000 ]
      4. 8.5.4  Wireless Power Supply FOD RAM Register (address = 0xE1) [reset =00000000 ]
      5. 8.5.5  Wireless Power User Header RAM Register (address = 0xE2) [reset = 00000000]
      6. 8.5.6  Wireless Power USER VRECT Status RAM Register (address = 0xE3) [reset = 00000000]
      7. 8.5.7  Wireless Power VOUT Status RAM Register (address = 0xE4) [reset = 00000000]
      8. 8.5.8  Wireless Power REC PWR Byte Status RAM Register (address = 0xE8) [reset = 00000000]
      9. 8.5.9  Wireless Power Mode Indicator Register (address = 0xEF) [reset = 00000000]
      10. 8.5.10 Wireless Power Prop Packet Payload RAM Byte 0 Register (address = 0xF1) [reset = 00000000]
      11. 8.5.11 Wireless Power Prop Packet Payload RAM Byte 1 Register (address = 0xF2) [reset = 00000000]
      12. 8.5.12 Wireless Power Prop Packet Payload RAM Byte 2 Register (address = 0xF3) [reset = 00000000]
      13. 8.5.13 Wireless Power Prop Packet Payload RAM Byte 3 Register (address = 0xF4) [reset = 00000000]
      14. 8.5.14 RXID Readback Register (address = 0xF5 - 0xFA) [reset = see note]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Dual Mode Design (WPC and PMA Compliant) Power Supply 5-V Output with 1-A Maximum Current
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Output Voltage Set Point
          2. 9.2.1.2.2  Output and Rectifier Capacitors
            1. 9.2.1.2.2.1 TMEM
          3. 9.2.1.2.3  Maximum Output Current Set Point
          4. 9.2.1.2.4  TERM Resistor
          5. 9.2.1.2.5  Setting LPRB1 and LPRB2 Resistors
          6. 9.2.1.2.6  I2C
          7. 9.2.1.2.7  Communication Current Limit
          8. 9.2.1.2.8  Receiver Coil
          9. 9.2.1.2.9  Series and Parallel Resonant Capacitors
          10. 9.2.1.2.10 Communication, Boot and Clamp Capacitors
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Embedded in System Board
      3. 9.2.3 bq51222 Implemented in Back Cover
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.