SLVSI97A January   2025  – April 2025 BZX84WC15V-Q1 , BZX84WC27V-Q1 , BZX84WC39V-Q1 , BZX84WC8V2-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC (1) BZX84WCx-Q1 UNIT
DCK (SC-70)
3 PINS
RθJA Junction-to-ambient thermal resistance 345.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 223.0 °C/W
RθJB Junction-to-board thermal resistance 159.0 °C/W
ΨJT Junction-to-top characterization parameter 113.6 °C/W
ΨJB Junction-to-board characterization parameter 157.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.