SWRS105B May   2011  – June 2014 CC115L

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
      1. 4.5.1 Typical TX Current Consumption over Temperature and Supply Voltage, 868 MHz
      2. 4.5.2 Typical TX Current Consumption over Temperature and Supply Voltage, 915 MHz
    6. 4.6  RF Transmit Section
      1. 4.6.1 Typical Variation in Output Power over Temperature and Supply Voltage, 868 MHz
      2. 4.6.2 Typical Variation in Output Power over Temperature and Supply Voltage, 915 MHz
    7. 4.7  Crystal Oscillator
    8. 4.8  Frequency Synthesizer Characteristics
    9. 4.9  DC Characteristics
    10. 4.10 Power-On Reset
    11. 4.11 Thermal Characteristics
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
      1. 5.5.1 Chip Status Byte
      2. 5.5.2 Register Access
      3. 5.5.3 SPI Read
      4. 5.5.4 Command Strobes
      5. 5.5.5 TX FIFO Access
      6. 5.5.6 PATABLE Access
    6. 5.6  Microcontroller Interface and Pin Configuration
      1. 5.6.1 Configuration Interface
      2. 5.6.2 General Control and Status Pins
    7. 5.7  Data Rate Programming
    8. 5.8  Packet Handling Hardware Support
      1. 5.8.1 Packet Format
        1. 5.8.1.1 Packet Length > 255
      2. 5.8.2 Packet Handling
      3. 5.8.3 Packet Handling in Firmware
    9. 5.9  Modulation Formats
      1. 5.9.1 Frequency Shift Keying
      2. 5.9.2 Amplitude Modulation
    10. 5.10 Radio Control
      1. 5.10.1 Power-On Start-Up Sequence
        1. 5.10.1.1 Automatic POR
        2. 5.10.1.2 Manual Reset
      2. 5.10.2 Crystal Control
      3. 5.10.3 Voltage Regulator Control
      4. 5.10.4 Transmit Mode (TX)
      5. 5.10.5 Timing
        1. 5.10.5.1 Overall State Transition Times
        2. 5.10.5.2 Frequency Synthesizer Calibration Time
    11. 5.11 TX FIFO
    12. 5.12 Frequency Programming
    13. 5.13 VCO
      1. 5.13.1 VCO and PLL Self-Calibration
    14. 5.14 Voltage Regulators
    15. 5.15 Output Power Programming
    16. 5.16 General Purpose and Test Output Control Pins
    17. 5.17 Asynchronous and Synchronous Serial Operation
      1. 5.17.1 Asynchronous Serial Operation
      2. 5.17.2 Synchronous Serial Operation
    18. 5.18 System Considerations and Guidelines
      1. 5.18.1 SRD Regulations
      2. 5.18.2 Calibration in Multi-Channel Systems
      3. 5.18.3 Wideband Modulation when not Using Spread Spectrum
      4. 5.18.4 Data Burst Transmissions
      5. 5.18.5 Continuous Transmissions
      6. 5.18.6 Increasing Output Power
    19. 5.19 Configuration Registers
      1. 5.19.1 Configuration Register Details - Registers with preserved values in SLEEP state
      2. 5.19.2 Configuration Register Details - Registers that Lose Programming in SLEEP State
      3. 5.19.3 Status Register Details
    20. 5.20 Development Kit Ordering Information
  6. 6Applications, Implementation, and Layout
    1. 6.1 Bias Resistor
    2. 6.2 Balun and RF Matching
    3. 6.3 Crystal
    4. 6.4 Reference Signal
    5. 6.5 Additional Filtering
    6. 6.6 Power Supply Decoupling
    7. 6.7 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation from Texas Instruments
      2. 7.2.2 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
    7. 7.7 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Mechanical Packaging and Orderable Information

8.1 Packaging Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.