SWRS292A December   2023  – July 2025 CC2340R5-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RHB Package (Top View)
    2. 6.2 Signal Descriptions—RHB Package
    3. 6.3 Connections for Unused Pins and Modules—RHB Package
    4. 6.4 RHB Peripheral Pin Mapping
    5. 6.5 RHB Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 Thermal Shutdown
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 2.4GHz RX/TX CW
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.18.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.18.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.18.3.4 32kHz RC Oscillator (LFOSC)
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 UART
        1. 7.19.1.1 UART Characteristics
      2. 7.19.2 SPI
        1. 7.19.2.1 SPI Characteristics
        2. 7.19.2.2 SPI Controller Mode
        3. 7.19.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.19.2.4 SPI Peripheral Mode
        5. 7.19.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.19.3 I2C
        1. 7.19.3.1 I2C
        2. 7.19.3.2 I2C Timing Diagram
      4. 7.19.4 GPIO
        1. 7.19.4.1 GPIO DC Characteristics
      5. 7.19.5 ADC
        1. 7.19.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.19.6 Comparators
        1. 7.19.6.1 Ultra-Low Power Comparator
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.4 Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Signal Descriptions—RHB Package

Table 6-1 Signal Descriptions—RHB Package
PINI/OTYPEDESCRIPTION
NAMENO.
EGP——GNDGround—exposed ground pad(1)
VDDR1—PowerInternal 1.5V supply, must be powered from the internal DC/DC converter or the internal LDO(2)(3)(4)
DIO82I/ODigitalGPIO
DIO113I/ODigitalGPIO
DIO124I/ODigitalGPIO, high-drive capability
DIO135I/ODigitalGPIO
VDDS6—Power1.71V to 3.8V DIO supply(5)
DIO147I/ODigitalGPIO
DIO16_SWDIO8I/ODigitalGPIO, SWD interface: mode select or SWDIO, high-drive capability
DIO17_SWDCK9I/ODigitalGPIO, SWD interface: clock, high-drive capability
DIO1810I/ODigitalGPIO, high-drive capability
DIO1911I/ODigitalGPIO, high-drive capability
DIO20_A1112I/ODigital or AnalogGPIO, analog capability
DIO21_A1013I/ODigital or AnalogGPIO, analog capability
VDDS14—Power1.71V to 3.8V DIO supply(5)
DIO22_A915I/ODigital or AnalogGPIO, analog capability
DIO23_A816I/ODigital or AnalogGPIO, analog capability
DIO24_A717I/ODigital or AnalogGPIO, analog capability, high-drive capability
DIO1_A418I/ODigital or AnalogGPIO, analog capability
RSTN19IDigitalReset, active low. No internal pullup resistor
DIO3_X32P20I/ODigital or AnalogGPIO, 32kHz crystal oscillator pin 1, Optional TCXO input
DIO4_X32N21I/ODigital or AnalogGPIO, 32kHz crystal oscillator pin 2
VDDD22—PowerFor decoupling of internal 1.28V regulated core-supply. Connect an external 1μF decoupling capacitor.(2)
DIO5_A223I/ODigital or AnalogGPIO, analog capability
DCDC24—PowerSwitching node of internal DC/DC converter(5)
VDDS25—Power1.71V to 3.8V analog supply(5)
DIO6_A126I/ODigital or AnalogGPIO, analog capability
VDDR27—PowerInternal 1.5V supply, must be powered from the internal DC/DC converter or the internal LDO. Connect an external 10μF decoupling capacitor.(2)(3)(4)
X48P28—Analog48MHz crystal oscillator pin 1
X48N29—Analog48MHz crystal oscillator pin 2
VDDS30—Power1.71V to 3.8V analog supply(5)
ANT31I/ORF2.4GHz TX, RX
RFGND32—RFGNDRF Ground
(1) EPG is the only non-RF ground connection for the device. A good electrical connection to the device ground on a printed circuit board (PCB) is imperative for proper device operation.
(2) Do not supply external circuitry from this pin.
(3) VDDR pins 1 and 27 must be tied together on the PCB.
(4) Output from internal DC/DC and LDO is trimmed to 1.5V.
(5) For more details, see the technical reference manual listed in Section 10.3.