SWRS306D October   2024  – December 2025 CC2755P10 , CC2755R10

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
      2. 6.1.2 Pin Diagram—YCJ package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
      2. 6.2.2 Signal Descriptions—YCJ Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
      2. 6.3.2 Connections for Unused Pins and Modules—YCJ Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
      2. 6.4.2 YCJ Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
      2. 6.5.2 YCJ Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption—Radio Modes (R variant)
    11. 7.11 Power Consumption–Radio Modes (P variant)
    12. 7.12 Nonvolatile (Flash) Memory Characteristics
    13. 7.13 Thermal Resistance Characteristics
    14. 7.14 RF Frequency Bands
    15. 7.15 Bluetooth Low Energy—Receive (RX)
    16. 7.16 Bluetooth Low Energy—Transmit (TX)
    17. 7.17 Bluetooth Channel Sounding
    18. 7.18 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    19. 7.19 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    20. 7.20 2.4GHz RX/TX CW
    21. 7.21 Timing and Switching Characteristics
      1. 7.21.1 Reset Timing
      2. 7.21.2 Wakeup Timing
      3. 7.21.3 Clock Specifications
        1. 7.21.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.21.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.21.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.21.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.21.3.5 32kHz RC Oscillator (LFOSC)
    22. 7.22 Peripheral Characteristics
      1. 7.22.1 UART
        1. 7.22.1.1 UART Characteristics
      2. 7.22.2 SPI
        1. 7.22.2.1 SPI Characteristics
        2. 7.22.2.2 SPI Controller Mode
        3. 7.22.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.22.2.4 SPI Peripheral Mode
        5. 7.22.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.22.3 I2C
        1. 7.22.3.1 I2C Characteristics
        2. 7.22.3.2 I2C Timing Diagram
      4. 7.22.4 I2S
        1. 7.22.4.1 I2S Controller Mode
        2. 7.22.4.2 I2S Peripheral Mode
      5. 7.22.5 GPIO
        1. 7.22.5.1 GPIO DC Characteristics
      6. 7.22.6 ADC
        1. 7.22.6.1 Analog-to-Digital Converter (ADC) Characteristics
      7. 7.22.7 Comparators
        1. 7.22.7.1 Low power comparator
      8. 7.22.8 Voltage Glitch Monitor
    23. 7.23 Typical Characteristics
      1. 7.23.1 MCU Current
      2. 7.23.2 RX Current
      3. 7.23.3 TX Current
      4. 7.23.4 RX Performance
      5. 7.23.5 TX Performance
      6. 7.23.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, Matter)
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1.2 Pin Diagram—YCJ package

CC2755R10 CC2755P10 YCJ WCSP Pinout Preview (Top View) Figure 6-2 YCJ WCSP Pinout Preview (Top View)
Table 6-1 Legend
Legend
High Drive Capable
Analog Capable
Analog and High Drive Capable

The following I/O pins have high-drive capabilities:

  • E8, DIO2
  • E7, DIO3
  • H7, DIO9_SWDIO
  • H6, DIO10_SWDCK
  • G3, DIO17_A8
  • F3, DIO18_A7

The following I/O pins have analog capabilities:

  • G3, DIO17_A8
  • F3, DIO18_A7
  • H2, DIO19_A6
  • G2, DIO20_A5
  • F2, DIO21_A4
  • E2, DIO22_A3
  • D3, DIO25_A2
  • B2, DIO27_A1
  • B3, DIO28_A0
  • B4, DIO29_A10
  • B5, DIO30_A9
Table 6-2 DIO Voltage Domains
VDDS VDDIO
DIO17_A8 DIO0
DIO18_A7 DIO1
DIO19_A6 DIO2
DIO20_A5 DIO3
DIO21_A4 DIO4
DIO22_A3 DIO5
DIO23_X32P DIO6
DIO24_X32N DIO7
DIO25_A2 DIO8
DIO26 DIO9_SWDIO
DIO27_A1 DIO10_SWDCK
DIO28_A0 DIO11
DIO29_A10 DIO12
DIO30_A9 DIO13
DIO14
DIO15
DIO16