SNAS833A November   2021  – May 2022 CDCDB400

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
      2. 8.3.2 Output Enable Control
      3. 8.3.3 SMBus
        1. 8.3.3.1 SMBus Address Assignment
    4. 8.4 Device Functional Modes
      1. 8.4.1 CKPWRGD_PD# Function
      2. 8.4.2 OE[3:0]# and SMBus Output Enables
      3. 8.4.3 Output Slew Rate Control
      4. 8.4.4 Output Impedance Control
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 CDCDB400 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Enable Control Method
        2. 9.2.2.2 SMBus Address
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 TICS Pro
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 4 LP-HCSL outputs with programmable integrated 85-Ω (default) or 100-Ω differential output terminations
  • 4 hardware output enable (OE#) controls
  • Additive phase jitter after PCIE Gen 6 filter: 20 fs, RMS (maximum)
  • Additive phase jitter after PCIE Gen 5 filter: 25 fs, RMS (maximum)
  • Additive phase jitter after DB2000Q filter: 38 fs, RMS (maximum)
  • Supports Common Clock (CC) and Individual Reference (IR) architectures
    • Spread spectrum-compatible
  • Output-to-output skew: < 50 ps
  • Input-to-output delay: < 3 ns

  • Fail-safe input

  • Programmable output slew rate control

  • 3 selectable SMBus addresses

  • 3.3-V core and IO supply voltages
  • Hardware-controlled low power mode (PD#)
  • Current consumption: 46 mA maximum
  • 5-mm × 5-mm, 32-pin VQFN package