SLPS371A December   2011  – September 2016 CSD16327Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (December 2011) to A Revision

  • Added Device and Documentation Support sectionGo
  • Changed Description textGo
  • Changed ID Continuos Drain Current from 21 A : to 22 AGo
  • Changed IDM from 112 A : to 240 AGo
  • Changed PD Power Dissipation from 3 W : to 2.8 WGo
  • Changed Note 2 in Absolute Maximum Ratings tableGo
  • Changed RθJA from 56°C/W : to 55°C/WGo
  • Changed Figure 10 to reflect measured dataGo
  • Changed MECHANICAL DATA section to Mechanical, Packaging, and Orderable Information sectionGo