SLPS374A November   2012  – September 2014 CSD17559Q5

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5 Package Dimensions
    2. 7.2 Q5 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQH|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Specifications

5.1 Electrical Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC CHARACTERISTICS
BVDSS Drain-to-Source Voltage VGS = 0 V, IDS = 250 μA 30 V
IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 24 V 1 μA
IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 20 V 100 nA
VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, IDS = 250 μA 1.2 1.4 1.7 V
RDS(on) Drain-to-Source On-Resistance VGS = 4.5 V, IDS = 40 A 1.15 1.5 mΩ
VGS = 10 V, IDS = 40 A 0.95 1.15 mΩ
gƒs Transconductance VDS = 15 V, IDS = 40 A 235 S
DYNAMIC CHARACTERISTICS
Ciss Input Capacitance VGS = 0 V, VDS = 15 V,
ƒ = 1 MHz		 7070 9200 pF
Coss Output Capacitance 1780 2314 pF
Crss Reverse Transfer Capacitance 87 113 pF
RG Series Gate Resistance 1.2 2.4 Ω
Qg Gate Charge Total (4.5 V) VDS = 15 V, IDS = 40 A 39 51 nC
Qgd Gate Charge Gate-to-Drain 9.3 nC
Qgs Gate Charge Gate-to-Source 14.4 nC
Qg(th) Gate Charge at Vth 8.3 nC
Qoss Output Charge VDS = 15 V, VGS = 0 V 50 nC
td(on) Turn On Delay Time VDS = 15 V, VGS = 4.5 V,
IDS = 40 A, RG = 2 Ω		 20 ns
tr Rise Time 41 ns
td(off) Turn Off Delay Time 32 ns
tƒ Fall Time 14 ns
DIODE CHARACTERISTICS
VSD Diode Forward Voltage ISD = 40 A, VGS = 0 V 0.8 1 V
Qrr Reverse Recovery Charge VDD= 15 V, IF = 40 A, di/dt = 300 A/μs 80 nC
trr Reverse Recovery Time 37 ns

5.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJC Junction-to-Case Thermal Resistance(1) 1.2 °C/W
RθJA Junction-to-Ambient Thermal Resistance(1)(2) 50
(1) RθJC is determined with the device mounted on a 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu pad on a 1.5 inches × 1.5 inches
(3.81 cm × 3.81 cm), 0.06 inch (1.52 mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1 inch2 (6.45 cm2), 2 oz. (0.071 mm thick) Cu.
M0137-01_LPS198.gif
 Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of
2-oz. (0.071-mm thick) Cu.
M0137-02_LPS198.gif
 Max RθJA = 125°C/W when mounted on a minimum pad area of
2-oz. (0.071-mm thick) Cu.

5.3 Typical MOSFET Characteristics

(TA = 25°C unless otherwise stated)
graph01_SLPS374A.png
Figure 1. Transient Thermal Impedance
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Figure 2. Saturation Characteristics
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Figure 4. Gate Charge
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Figure 6. Threshold Voltage vs Temperature
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Figure 8. Normalized On-State Resistance vs Temperature
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Figure 10. Safety Operating Area
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Figure 12. Maximum Drain Current vs Temperature
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Figure 3. Transfer Characteristics
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Figure 5. Capacitance
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Figure 7. On-State Resistance vs Gate-to-Source Voltage
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Figure 9. Typical Diode Forward Voltage
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Figure 11. Single Pulse Unclamped Inductive Switching