SLPS367B August   2012  – July 2014 CSD18502KCS

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KCS Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KCS|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 KCS Package Dimensions

DimensionsDrawing5.png

Notes:

  1. All linear dimensions are in inches.
  2. This drawing is subject to change without notice.
  3. Lead dimensions are not controlled within 'C' area
  4. All lead dimensions apply before solder dip.
  5. The center lead is in electrical contact with the mounting tab.
  6. The chamfer at 'F' is optional.
  7. Thermal pad contour at 'G' optional with these dimensions
  8. 'H' falls within JEDEC TO-220 variation AB, except minimum lead thickness, minimum exposed pad length, and maximum body length.

Pin Configuration

Position Designation
Pin 1 Gate
Pin 2 / Tab Drain
Pin 3 Source