SLPS264D October   2010  – May 2015 CSD86330Q3D

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Power Block Performance
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Device Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Power Loss Curves
    2. 6.2 Safe Operating Curves (SOA)
    3. 6.3 Normalized Curves
    4. 6.4 Calculating Power Loss and SOA
      1. 6.4.1 Design Example
      2. 6.4.2 Calculating Power Loss
      3. 6.4.3 Calculating SOA Adjustments
  7. 7Recommended PCB Design Overview
    1. 7.1 Electrical Performance
    2. 7.2 Thermal Performance
  8. 8Device and Documentation Support
    1. 8.1 Trademarks
    2. 8.2 Electrostatic Discharge Caution
    3. 8.3 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Q3D Package Dimensions
    2. 9.2 Land Pattern Recommendation
    3. 9.3 Stencil Recommendation
    4. 9.4 Q3D Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQZ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Mechanical, Packaging, and Orderable Information

9.1 Q3D Package Dimensions

CSD86330Q3D M0192-01_LPS264.gif
DIM MILLIMETERS INCHES
MIN MAX MIN MAX
A 1.40 1.5 0.055 0.059
b 0.280 0.400 0.011 0.016
c 0.150 0.250 0.006 0.010
c1 0.150 0.250 0.006 0.010
d 0.940 1.040 0.037 0.041
d1 0.160 0.260 0.006 0.010
d2 0.150 0.250 0.006 0.010
d3 0.250 0.350 0.010 0.014
D1 3.200 3.400 0.126 0.134
D2 2.650 2.750 0.104 0.108
E 3.200 3.400 0.126 0.134
E1 3.200 3.400 0.126 0.134
E2 1.750 1.850 0.069 0.073
e 0.650 TYP 0.026 TYP
L 0.400 0.500 0.016 0.020
θ 0.00 — — —
K 0.300 TYP 0.012 TYP

9.2 Land Pattern Recommendation

CSD86330Q3D M0193-01_LPS264.gif

NOTE:

Dimensions are in mm (inches).

9.3 Stencil Recommendation

CSD86330Q3D M0207-01_LPS264.gif

NOTE:

Dimensions are in mm (inches).

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.

9.4 Q3D Tape and Reel Information

CSD86330Q3D m0144-01_lps202.gif

NOTES:

1. 10-sprocket hole-pitch cumulative tolerance ±0.2
 2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm
 3. Material: black static-dissipative polystyrene
 4. All dimensions are in mm, unless otherwise specified.
 5. Thickness: 0.30 ±0.0 5 mm
 6. MSL1 260°C (IR and convection) PbF reflow compatible