SLPS286D June   2011  – February 2017 CSD87352Q5D

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Power Block Performance
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Device Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Equivalent System Performance
      2. 6.1.2 Power Loss Curves
      3. 6.1.3 Safe Operating Area (SOA) Curves
      4. 6.1.4 Normalized Curves
    2. 6.2 Typical Application
      1. 6.2.1 Calculating Power Loss and SOA
        1. 6.2.1.1 Design Example
        2. 6.2.1.2 Calculating Power Loss
        3. 6.2.1.3 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Electrical Performance
      2. 7.1.2 Thermal Performance
    2. 7.2 Layout Example
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Q5D Package Dimensions
    2. 9.2 Land Pattern Recommendation
    3. 9.3 Stencil Recommendation
    4. 9.4 Q5D Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Specifications

5.1 Absolute Maximum Ratings

TA = 25°C (unless otherwise noted) (1)
PARAMETER CONDITIONS MIN MAX UNIT
Voltage VIN to PGND 30 V
VSW to PGND 30
VSW to PGND (10 ns) 32
TG to TGR –8 10
BG to PGND –8 10
Pulsed current rating, IDM(2) 60 A
Power dissipation, PD 8.5 W
Avalanche energy, EAS Sync FET, ID = 65 A, L = 0.1 mH 211 mJ
Control FET, ID = 37 A, L = 0.1 mH 68
Operating junction, TJ –55 150 °C
Storage temperature, TSTG –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Pulse duration ≤ 50 µs. Duty cycle ≤ 0.01%.

5.2 Recommended Operating Conditions

TA = 25°C (unless otherwise noted)
PARAMETER CONDITIONS MIN MAX UNIT
Gate drive voltage, VGS 4.5 8 V
Input supply voltage, VIN 27 V
Switching frequency, ƒSW CBST = 0.1 μF (min) 1500 kHz
Operating current 25 A
Operating temperature, TJ 125 °C

5.3 Power Block Performance

TA = 25°C (unless otherwise noted)
PARAMETER CONDITIONS MIN TYP MAX UNIT
Power loss, PLOSS (1) VIN = 12 V, VGS = 5 V,
VOUT = 1.3 V, IOUT = 15 A,
ƒSW = 500 kHz, LOUT = 0.3 µH, TJ = 25°C 		1.8 W
VIN quiescent current, IQVIN TG to TGR = 0 V
BG to PGND = 0 V 		10 µA
(1) Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins and using a high-current 5-V driver IC.

5.4 Thermal Information

TA = 25°C (unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNIT
RθJA Junction-to-ambient thermal resistance (min Cu)(1)(2) 150 °C/W
Junction-to-ambient thermal resistance (max Cu)(1)(2) 82
RθJC Junction-to-case thermal resistance (top of package)(2) 33 °C/W
Junction-to-case thermal resistance (PGND pin)(2) 2.8
(1) Device mounted on FR4 material with 1-in2 (6.45-cm2) Cu.
(2) RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in
(3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design.

5.5 Electrical Characteristics

TA = 25°C (unless otherwise stated)
PARAMETER TEST CONDITIONS Q1 Control FET Q2 Sync FET UNIT
MIN TYP MAX MIN TYP MAX
STATIC CHARACTERISTICS
BVDSS Drain-to-source voltage VGS = 0 V, IDS = 250 μA 30 30 V
IDSS Drain-to-source leakage current VGS = 0 V, VDS = 24 V 1 1 μA
IGSS Gate-to-source leakage current VDS = 0 V, VGS = +10 / –8 V 100 100 nA
VGS(th) Gate-to-source threshold voltage VDS = VGS, IDS = 250 μA 1 2.1 0.75 1.15 V
ZDS(on)(1) Effective AC on-impedance VIN = 12 V, VGS = 5 V,
VOUT = 1.3 V, IOUT = 15 A,
ƒSW = 500 kHz,
LOUT = 0.3 µH, TJ = 25°C 		9 2.8 mΩ
gfs Transconductance VDS = 15 V, IDS = 15 A 51 87 S
DYNAMIC CHARACTERISTICS
CISS Input capacitance VGS = 0 V, VDS = 15 V,
ƒ = 1 MHz		 740 890 1500 1800 pF
COSS Output capacitance 315 380 645 775 pF
CRSS Reverse transfer capacitance 12 14 38 46 pF
RG Series gate resistance 1.2 2.4 0.6 1.2 Ω
Qg Gate charge total (4.5 V) VDS = 15 V,
IDS = 15 A		 4.6 5.5 10.4 12.5 nC
Qgd Gate charge gate-to-drain 0.9 1.9 nC
Qgs Gate charge gate-to-source 1.5 2.2 nC
Qg(th) Gate charge at Vth 0.9 1.2 nC
QOSS Output charge VDS = 9.8 V, VGS = 0 V 6.6 13 nC
td(on) Turnon delay time VDS = 15 V, VGS = 4.5 V,
IDS = 15 A, RG = 2 Ω		 5.4 6.1 ns
tr Rise time 11 7 ns
td(off) Turnoff delay time 9.5 16 ns
tf Fall time 2 2.7 ns
DIODE CHARACTERISTICS
VSD Diode forward voltage IDS = 15 A, VGS = 0 V 0.8 0.8 V
Qrr Reverse recovery charge Vdd = 9.8 V, IF = 15 A,
di/dt = 300 A/μs		 11.3 16.3 nC
trr Reverse recovery time 16 20 ns
(1) Equivalent system performance based on application testing. See Application and Implementation for details.

CSD87352Q5D M0189-01_LPS293.gif
Max RθJA = 82°C/W when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
CSD87352Q5D M0190-01_LPS293.gif
Max RθJA = 150°C/W when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu.

5.6 Typical Power Block Device Characteristics

TJ = 125°C, unless stated otherwise.
CSD87352Q5D graph01_LPS286.png
Figure 1. Power Loss vs Output Current
CSD87352Q5D graph03_LPS286.png
Figure 3. Safe Operating Area – PCB Vertical Mount(1)1
CSD87352Q5D graph05_LPS286.png Figure 5. Typical Safe Operating Area(1)1
CSD87352Q5D graph02_LPS286.png
Figure 2. Normalized Power Loss vs Temperature
CSD87352Q5D graph04_LPS286.png
Figure 4. Safe Operating Area – PCB Horizontal Mount(1)1
1. The typical power block system characteristic curves are based on measurements made on a PCB design with dimensions of 4 in (W) × 3.5 in (L) x 0.062 in (H) and 6 copper layers of 1-oz copper thickness. See Application and Implementation section for detailed explanation.
CSD87352Q5D graph06_LPS286.png
Figure 6. Normalized Power Loss vs Switching Frequency
CSD87352Q5D graph08_LPS286.png
Figure 8. Normalized Power Loss vs Output Voltage
CSD87352Q5D graph07_LPS286.png
Figure 7. Normalized Power Loss vs Input Voltage
CSD87352Q5D graph09_LPS286.png
Figure 9. Normalized Power Loss vs Output Inductance

5.7 Typical Power Block MOSFET Characteristics

TA = 25°C, unless stated otherwise.
CSD87352Q5D graph10_LPS286.png
Figure 10. Control MOSFET Saturation
CSD87352Q5D graph12_LPS286.png
Figure 12. Control MOSFET Transfer
CSD87352Q5D graph14_LPS286.png
Figure 14. Control MOSFET Gate Charge
CSD87352Q5D graph16_LPS286.png
Figure 16. Control MOSFET Capacitance
CSD87352Q5D graph18_LPS286.png
Figure 18. Control MOSFET VGS(th)
CSD87352Q5D graph20_LPS286.png
Figure 20. Control MOSFET RDS(on) vs VGS
CSD87352Q5D graph22_LPS286.png
Figure 22. Control MOSFET Normalized RDS(on)
CSD87352Q5D graph24_LPS286.png
Figure 24. Control MOSFET Body Diode
CSD87352Q5D graph26_LPS286.png
Figure 26. Control MOSFET Unclamped Inductive Switching
CSD87352Q5D graph11_LPS286.png
Figure 11. Sync MOSFET Saturation
CSD87352Q5D graph13_LPS286.png
Figure 13. Sync MOSFET Transfer
CSD87352Q5D graph15_LPS286.png
Figure 15. Sync MOSFET Gate Charge
CSD87352Q5D graph17_LPS286.png
Figure 17. Sync MOSFET Capacitance
CSD87352Q5D graph19_LPS286.png
Figure 19. Sync MOSFET VGS(th)
CSD87352Q5D graph21_LPS286.png
Figure 21. Sync MOSFET RDS(on) vs VGS
CSD87352Q5D graph23_LPS286.png
Figure 23. Sync MOSFET Normalized RDS(on)
CSD87352Q5D graph25_LPS286.png
Figure 25. Sync MOSFET Body Diode
CSD87352Q5D graph27_LPS286.png
Figure 27. Sync MOSFET Unclamped Inductive Switching