SLPS751 January   2023 CSD95411

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Third-Party Products Disclaimer
    2. 5.2 Documentation Support
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • RRB|41
Thermal pad, mechanical data (Package|Pins)

5.5 Trademarks

NexFET and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.