SNAS410F May   2008  – July 2016 DAC121S101QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DAC121S101QML-SP Electrical Characteristics DC Parameters
    6. 6.6 DAC121S101QML-SP Electrical Characteristics AC and Timing Characteristics
    7. 6.7 DAC121S101QML Electrical Characteristics Radiation Electrical Characteristics
    8. 6.8 DAC121S101QML-SP Electrical Characteristics Operating Life Test Delta Parameters TA at 25°C
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 DAC Section
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Amplifier
      4. 7.3.4 Power-On Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Input Shift Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Operation
      2. 8.1.2 DSP and Microprocessor Interfacing
        1. 8.1.2.1 ADSP-2101/ADSP2103 Interfacing
        2. 8.1.2.2 80C51/80L51 Interface
        3. 8.1.2.3 68HC11 Interface
        4. 8.1.2.4 Microwire Interface
      3. 8.1.3 Radiation Environments
        1. 8.1.3.1 Total Ionizing Dose
          1. 8.1.3.1.1 DAC121S101WGRQV 5962R0722601VZA
          2. 8.1.3.1.2 DAC121S101WGRLV 5962R0722602VZA
        2. 8.1.3.2 Single Event Latch-Up and Functional Interrupt
        3. 8.1.3.3 Single Event Upset
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Using References as Power Supplies
      1. 9.1.1 LM4050QML-SP
      2. 9.1.2 LP3985
      3. 9.1.3 LP2980-N
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Specification Definitions
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Engineering Samples

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 Engineering Samples

Engineering samples are available for order and are identified by the "MPR" in the orderable device name (see Packaging Information in the Addendum). Engineering (MPR) samples meet the performance specifications of the datasheet at room temperature only and have not received the full space production flow or testing. Engineering samples may be QCI rejects that failed tests that would not impact the performance at room temperature, such as radiation or reliability testing.