SBAS490B December   2011  – May 2015 DAC1282

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements: Serial Peripheral Interface (SPI) Timing
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Feature Description
      1. 8.2.1  Signal Output (VOUTP, VOUTN)
      2. 8.2.2  DAC Modes
        1. 8.2.2.1 Sine Mode
        2. 8.2.2.2 DC Mode
        3. 8.2.2.3 Pulse Mode
        4. 8.2.2.4 Digital Data Mode
      3. 8.2.3  Reference Voltage (VREF)
      4. 8.2.4  Output Filter (CAPP, CAPN)
      5. 8.2.5  Output Switch (SWINP, SWINN, SWOUTP, SWOUTN)
      6. 8.2.6  Clock Input (CLK)
      7. 8.2.7  Switch Control/External Digital Input (SW/TD)
        1. 8.2.7.1 SW Function
        2. 8.2.7.2 TD Function
      8. 8.2.8  SYNC
      9. 8.2.9  RESET/PWDN
      10. 8.2.10 AVDD, AVSS, and DVDD Power Supplies
        1. 8.2.10.1 Power Consumption
        2. 8.2.10.2 Offset and Gain Error
        3. 8.2.10.3 Signal-to-Noise Ratio (SNR)
        4. 8.2.10.4 DC Noise
        5. 8.2.10.5 Total Harmonic Distortion (THD)
      11. 8.2.11 Step Response
      12. 8.2.12 Frequency Response
    3. 8.3 Device Functional Modes
      1. 8.3.1 Serial Interface
        1. 8.3.1.1 Serial Communications
        2. 8.3.1.2 Chip Select (CS)
        3. 8.3.1.3 Serial Clock (SCLK)
        4. 8.3.1.4 Data Input (DIN)
        5. 8.3.1.5 Data Output (DOUT)
      2. 8.3.2 SPI Timeout
    4. 8.4 Programming
      1. 8.4.1 Commands
        1. 8.4.1.1 RREG: Read From Registers
        2. 8.4.1.2 WREG: Write To Registers
        3. 8.4.1.3 RESET: Device Reset
    5. 8.5 Register Map
      1. 8.5.1 Register Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Single-Channel Seismic System
      2. 9.2.2 Four-Channel Seismic System
  10. 10Device and Documentation Support
    1. 10.1 Community Resources
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Community Resources

The following links connect to TI community resources. Linked contents are provided AS IS by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.2 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

10.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.