SBAS442D august   2008  – august 2023 DAC5311 , DAC6311 , DAC7311

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements
    7. 7.7  Timing Diagrams
    8. 7.8  Typical Characteristics: AVDD = 5 V
    9. 7.9  Typical Characteristics: AVDD = 3.6 V
    10. 7.10 Typical Characteristics: AVDD = 2.7 V
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Resistor String
      3. 8.3.3 Output Amplifier
      4. 8.3.4 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Input Shift Register
        2. 8.5.1.2 SYNC Interrupt
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Microprocessor Interfacing
        1. 9.1.1.1 DACx311 to 8051 Interface
        2. 9.1.1.2 DACx311 to Microwire Interface
        3. 9.1.1.3 DACx311 to 68HC11 Interface
    2. 9.2 Typical Applications
      1. 9.2.1 Loop Powered Transmitter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Using the REF5050 as a Power Supply for the DACx311
      3. 9.2.3 Bipolar Operation Using the DACx311
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (July 2015) to Revision D (August 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to show package size instead of body size and added content to show difference among devicesGo
  • Changed power dissipation max value for normal mode at AVDD = 3.6 V to 5.5 V from 0.88 mW to 0.99 mW in Electrical Characteristics Go
  • Changed IDD max value for normal mode at AVDD = 3.6 V to 5.5 V from 160 µA to 180 µA in Electrical Characteristics Go

Changes from Revision B (May 2013) to Revision C (July 2015)

  • Added ESD Ratings table, and Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Added Device Comparison section and moved existing tables to this new sectionGo
  • Moved Operating Temperature parameter from Electrical Characteristics table to Recommended Operating Conditions table Go
  • Deleted Parameter Definitions section; definitions moved to new Glossary sectionGo

Changes from Revision A (August 2011) to Revision B (May 2013)

  • Changed all 1.8 V to 2.0 V throughout data sheetGo
  • Deleted the 1.8-V Typical Characteristics sectionGo
  • Changed X-axis for Figure 7-36, Power-Supply Current vs Power-Supply VoltageGo
  • Changed X-axis for Figure 7-37, Power-Down Current vs Power-Supply VoltageGo

Changes from Revision * (August, 2008) to Revision A (August, 2011)

  • Changed specifications and test conditions for input low voltage parameterGo
  • Changed specifications and test conditions for input high voltage parameterGo