SLASF62A June   2024  – November 2024 DAC80516

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - I2C Standard Mode
    7. 5.7  Timing Requirements - I2C Fast Mode
    8. 5.8  Timing Requirements - I2C Fast Mode Plus
    9. 5.9  Timing Requirements - SPI
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 6.3.1.1 DAC Register Structure
          1. 6.3.1.1.1 DAC Synchronous Operation
          2. 6.3.1.1.2 DAC Buffer Amplifier
          3. 6.3.1.1.3 DAC Transfer Function
      2. 6.3.2 Internal Reference
      3. 6.3.3 Power-On Reset (POR)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clear Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
  8. 7 Register Map
    1. 7.1 DAC80516 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Voltage Output
    2. 8.2 Typical Application
      1. 8.2.1 Programmable High-Current Voltage Output Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUY|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) DAC80516 UNIT
RUY (WQFN)
28 PINS
RθJA Junction-to-ambient thermal resistance 39.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.8 °C/W
RθJB Junction-to-board thermal resistance 15.9 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 15.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.