SBFS031F February   2006  – September 2016 DIX4192

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 RESET Operation
      2. 9.3.2 Master and Reference Clocks
      3. 9.3.3 Audio Serial Port Operation
      4. 9.3.4 Overview of the AES3 Digital Audio Interface Protocol
      5. 9.3.5 Digital Interface Transmitter (DIT) Operation
      6. 9.3.6 Digital Interface Receiver (DIR) Operation
      7. 9.3.7 General-Purpose Digital Outputs
      8. 9.3.8 Interrupt Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Host Interface Operation: Serial Peripheral Interface (SPI) Mode
      2. 9.4.2 Host Interface Operation: PHILIPS I2C Mode
    5. 9.5 Register Maps
      1. 9.5.1 Register and Data Buffer Organization
      2. 9.5.2 Control Registers
        1. 9.5.2.1 Registers 1F through 28: Q-Channel Sub-Code Data Registers
        2. 9.5.2.2 Registers 29 through 2C: IEC61937 PC/PD Burst Preamble
      3. 9.5.3 Channel Status and User Data Buffer Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Digital Audio Transformer Vendors
      2. 10.1.2 Receiver Input Interfacing
      3. 10.1.3 Transmitter Output Interfacing
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Differential Line Inputs and Output
        2. 10.2.2.2 Serial Ports
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.1.2 Development Support

For developmental support, see the following:

13.2 Documentation Support

13.2.1 Related Documentation

For related documentation, see the following:

  • DIT4096 96-kHz Digital Audio Transmitter, SBOS225
  • DIT4192 192-kHz Digital Audio Transmitter, SBOS229
  • SRC4184 4-Channel, Asynchronous Sample Rate Converter, SBFS026
  • SRC419 x 192-kHz Stereo Asynchronous Sample-Rate Converters, SBFS022
  • SN74LVC1G125 Single Bus Buffer Gate With 3-State Output, SCES223
  • SN74AVC1T45 Single-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and 3-State Outputs, SCES530
  • SN75ALS191 Dual Differential Line Driver, SLLS032

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

E2E is a trademark of Texas Instruments.

Dolby is a registered trademark of Dolby Laboratories, Inc.

SPI is a trademark of Motorola.

I2S is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.