DLPS207B February   2022  – December 2023 DLP2021-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Description (cont.)
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5.     12
    6. 6.5  Thermal Information
    7. 6.6  Electrical Characteristics
    8. 6.7  Timing Requirements
    9.     16
    10. 6.8  System Mounting Interface Loads
    11.     18
    12. 6.9  Micromirror Array Physical Characteristics
    13.     20
    14.     21
    15. 6.10 Micromirror Array Optical Characteristics
    16. 6.11 Window Characteristics
    17. 6.12 Chipset Component Usage Specification
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Micromirror Array
      2. 7.3.2 Double Data Rate (DDR) Interface
      3. 7.3.3 Micromirror Switching Control
      4. 7.3.4 DMD Voltage Supplies
      5. 7.3.5 Logic Reset
      6. 7.3.6 Temperature Sensing Diode
        1. 7.3.6.1 Temperature Sense Diode Theory
    4. 7.4 System Optical Considerations
      1. 7.4.1 Numerical Aperture and Stray Light Control
      2. 7.4.2 Pupil Match
      3. 7.4.3 Illumination Overfill and Alignment
    5. 7.5 DMD Image Performance Specification
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Application Mission Profile Consideration
  10. Power Supply Recommendations
    1. 9.1 Power Supply Sequencing Requirements
      1. 9.1.1 Power Up and Power Down
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Temperature Diode Pins
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Device Handling
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The DLP2021-Q1 automotive digital micromirror device (DMD) is designed for automotive exterior light control and display applications. Applications include ground projection that displays full color and animated and dynamic content. Ground projections help to facilitate vehicle-to-pedestrian (V2P) communication, such as back-up and door-open warnings, and orchestrate vehicle communication systems and vehicle personalization options. Due to their small form factor and low power operation, projectors with the DLP2021-Q1 chipset can support many projection applications. They can be placed in many locations in the car, including inside the side mirror, door panel, tail light, front grill, and more.

Device Information
PART NUMBER(1) PACKAGE BODY SIZE (NOM)
DLP2021-Q1 FQU (64) 8.55 mm × 16.80 mm
For all available packages, see the orderable addendum at the end of the data sheet.
GUID-20201217-CA0I-Z4P4-V7CC-KHTVM6ZD4J4T-low.svg DLP2021-Q1 System Block Diagram