DLPS124C November   2018  – May 2022 DLP3310

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Storage Conditions
    3. 6.3  ESD Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Electrical Characteristics
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics
    9. 6.9  System Mounting Interface Loads
    10. 6.10 Micromirror Array Physical Characteristics
    11. 6.11 Micromirror Array Optical Characteristics
    12. 6.12 Window Characteristics
    13. 6.13 Chipset Component Usage Specification
    14. 6.14 Software Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Interface
      2. 7.3.2 Low-Speed Interface
      3. 7.3.3 High-Speed Interface
      4. 7.3.4 Timing
    4. 7.4 Device Functional Modes
    5. 7.5 Optical Interface and System Image Quality Considerations
      1. 7.5.1 Numerical Aperture and Stray Light Control
      2. 7.5.2 Pupil Match
      3. 7.5.3 Illumination Overfill
    6. 7.6 Micromirror Array Temperature Calculation
    7. 7.7 Micromirror Landed-On/Landed-Off Duty Cycle
      1. 7.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 7.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 7.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 7.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Power Supply Power-Up Procedure
    2. 9.2 Power Supply Power-Down Procedure
    3. 9.3 Power Supply Sequencing Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Device Nomenclature
      2. 11.2.2 Device Markings
    3. 11.3 Documentation Support
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETERTEST CONDITIONS(2)MINTYPMAXUNIT
CURRENT
IDDSupply current: VDD(3) (4)VDD = 1.95 V135mA
VDD = 1.8 V123.6
IDDISupply current: VDDI(3)(4)VDDI = 1.95 V35.34mA
VDD = 1.8 V32
IOFFSETSupply current: VOFFSET(5)(6)VOFFSET = 10.5 V2.55mA
VOFFSET = 10 V2.5
IBIASSupply current: VBIAS(5)(6)VBIAS = 18.5 V1.25mA
VBIAS = 18 V1.2
IRESETSupply current: VRESET(6)VRESET = –14.5 V–2.55mA
VRESET = –14 V–2.5
POWER(7)
PDDSupply power dissipation: VDD(3)(4)VDD = 1.95 V263.25mW
VDD = 1.8 V222.48
PDDISupply power dissipation: VDDI(3)(4)VDDI = 1.95 V68.91mW
VDD = 1.8 V57.6
POFFSETSupply power dissipation: VOFFSET(5)(6)VOFFSET = 10.5 V26.78mW
VOFFSET = 10 V25
PBIASSupply power dissipation: VBIAS(5)(6)VBIAS = 18.5 V23.13mW
VBIAS = 18 V21.6
PRESETSupply power dissipation: VRESET(6)VRESET = –14.5 V36.98mW
VRESET = –14 V35
PTOTALSupply power dissipation: Total361.68419.05mW
LPSDR INPUT(8)
VIH(DC)DC input high voltage(9)0.7 × VDDVDD + 0.3V
VIL(DC)DC input low voltage(9)–0.30.3 × VDDV
VIH(AC)AC input high voltage(9)0.8 × VDDVDD + 0.3V
VIL(AC)AC input low voltage(9)–0.30.2 × VDDV
∆VTHysteresis ( VT+ – VT– )Figure 6-100.1 × VDD0.4 × VDDV
IILLow–level input currentVDD = 1.95 V; VI = 0 V–100nA
IIHHigh–level input currentVDD = 1.95 V; VI = 1.95 V100nA
LPSDR OUTPUT(10)
VOHDC output high voltageIOH = –2 mA0.8 × VDDV
VOLDC output low voltageIOL = 2 mA0.2 × VDDV
CAPACITANCE
CINInput capacitance LPSDRƒ = 1 MHz10pF
Input capacitance SubLVDSƒ = 1 MHz20pF
COUTOutput capacitanceƒ = 1 MHz10pF
CRESETReset group capacitanceƒ = 1 MHz; (768 × 344) micromirrors400500pF
Device electrical characteristics are in Recommended Operating Conditions, unless otherwise noted.
All voltage values are with respect to the ground pins (VSS).
To prevent excess current, the supply voltage delta |VDDI – VDD| must be less than the specified limit.
Supply power dissipation based on non–compressed commands and data.
To prevent excess current, the supply voltage delta |VBIAS – VOFFSET| must be less than the specified limit.
Supply power dissipation based on 3 global resets in 200 µs.
The following power supplies are all required to operate the DMD: VDD, VDDI, VOFFSET, VBIAS, VRESET. All VSS connections are also required.
LPSDR specifications are for pins LS_CLK and LS_WDATA.
Low-speed interface is LPSDR and adheres to the Electrical Characteristics and AC/DC Operating Conditions table in JEDEC Standard No. 209B, Low-Power Double Data Rate (LPDDR) JESD209B.
LPSDR specification is for pin LS_RDATA.