DLPS014F April   2010  – May 2018 DLPC200

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
    2.     Power and Ground Pins
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  Video Input Pixel Interface Timing Requirements
    7. 6.7  I2C Interface Timing Requirements
    8. 6.8  USB Read Interface Timing Requirements
    9. 6.9  USB Write Interface Timing Requirements
    10. 6.10 SPI Slave Interface Timing Requirements
    11. 6.11 Parallel Flash Interface Timing Requirements
    12. 6.12 Serial Flash Interface Timing Requirements
    13. 6.13 Static RAM Interface Timing Requirements
    14. 6.14 DMD Interface Timing Requirements
    15. 6.15 DLPA200 Interface Timing Requirements
    16. 6.16 DDR2 SDR Memory Interface Timing Requirements
    17. 6.17 Video Input Pixel Interface – Image Sync and Blanking Requirements
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Frame Rates
    4. 7.4 Device Functional Modes
      1. 7.4.1 Video Modes
      2. 7.4.2 Structured Light Modes
        1. 7.4.2.1 Static Image Buffer Mode
        2. 7.4.2.2 Real Time Structured Light Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 DLPC200 System Interfaces
          1. 8.2.2.1.1  DLPC200 Master, I2C Interface for EDID Programming
          2. 8.2.2.1.2  USB Interface
          3. 8.2.2.1.3  Bus Protocol
          4. 8.2.2.1.4  SPI Slave Interface
          5. 8.2.2.1.5  Parallel Flash Memory Interface
          6. 8.2.2.1.6  Serial Flash Memory Interface
          7. 8.2.2.1.7  SRAM Interface
          8. 8.2.2.1.8  DDR2 SDR Memory Interface
          9. 8.2.2.1.9  Projector Image and Control Port Signals
          10. 8.2.2.1.10 SDRAM Memory
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Power-Up Requirements
    2. 9.2 Power-Down Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Impedance Requirements
      2. 10.1.2 PCB Signal Routing
      3. 10.1.3 Fiducials
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heat Sink
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Marking
    2. 11.2 Documentation Support
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Bus Protocol

USB is a polled bus. The host controller (typically at PC) initiates all data transfers. Each transaction begins when the PC sends a packet. Communications are always through the bulk transfer mode, and 512 bytes of data are always written/read at a time. The packet consists of the following:

  • Header (6 bytes)
  • Data (505 bytes)
  • Checksum (1 byte)

The USB device that is addressed selects itself by decoding the appropriate address fields. The direction of data transfer, either read or write, is specified in the packet header. The source of the transaction then sends a data packet or indicates it has no data to transfer. At the end of either a single packet transfer or a multi-packet transfer, the destination responds with a handshake packet indicating whether the transfer was successful.

The packet header consists of:

  • CMD1 – Indicates if packet is write/write response or read/read response
  • CMD2 – Groups major functions together
  • CMD3 – Provides more information about packet grouping defined in CMD2
  • CMD4 – Used to indicate location of data in a multi-packet transfer
  • Len_MSB:Len_LSB – Valid number of bytes of data transferred in packet data

DLPC200 usb_packet_lps014.gifFigure 15. USB Data Packet

As discussed previously, the header describes whether the data transaction is to be a read or write and designates the data endpoint. The data portion of the packet carries the payload and is followed by a handshaking mechanism, checksum, that reports if the data was received successfully, or if the endpoint is stalled or not available to accept data.

Table 3. Recommended USB Devices

PART NUMBER MANUFACTURER
CY7C68013A Cypress
24LC128I/SN Microchip Technology