SNLS767
April
2024
ADVANCE INFORMATION
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1
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1Features
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2Applications
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3Description
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4Device Comparison Table
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5Application Information
- 5.1
MAC Security
- 5.2
Time Syncronization
- 5.3
TC10 Sleep Wake-up
- 5.4
DP83TC817 EVM-MC and Software
Support
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6Device and Documentation
Support
- 6.1
Receiving Notification of Documentation Updates
- 6.2
Support Resources
- 6.3
Community Resources
- 6.4
Trademarks
- 6.5
Electrostatic Discharge Caution
- 6.6
Glossary
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7Revision History
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8Mechanical,
Packaging, and Orderable Information
- 8.1
Package Option Addendum
- 8.1.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
1 Features
- IEEE 802.1AE MACsec
- MACsec frame expansion: Inbuilt
buffering and flow control support to handle 12 byte IPG ethernet frames
- Authentication, encryption at line
rate
- Cipher suites: GCM-AES-XPN-128/256,
GCM-AES-128/256
- Secure Channel: Total 16 SAK enabling
8 Tx/Rx SC
- Auto rollover support for SAK
- Ingress/Egress classification for
Ethertype, VLAN, DMAC: up to 8 parallel rules
- Window replay protection
- IEEE 802.1AS time synchronization
- Highly accurate 1pps signal <
+/-5 ns
- Precise time stamping for MACsec
encoded PTP packets
- Multiple IOs for event capture and
trigger
- IEEE 802.3bw
& OA 100BASE-T1 compliant
- TC-10
compliant
- < 20μA sleep current
- Fast wake from sleep by retaining PHY
configuration during sleep (optional)
- MAC Interfaces:
MII, RMII, RGMII, SGMII
- Pin compatible
with TI's 1000BASE-T1 PHY
- Single board design for 100BASE-T1
and 1000BASE-T1 with required BOM change
- Diagnostic tool
kit
- Signal Quality Indication (SQI) & Time Domain
Reflectometry (TDR)
- Voltage, Temperature & ESD sensors
- AEC-Q100 qualified for Automotive Applications:
- Temperature grade 1: –40°C to +125 °C