SNLS767 April   2024

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Device Comparison Table
  6. 5Application Information
    1. 5.1 MAC Security
    2. 5.2 Time Syncronization
    3. 5.3 TC10 Sleep Wake-up
    4. 5.4 DP83TC817 EVM-MC and Software Support
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information
    1. 8.1 Package Option Addendum
      1. 8.1.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • IEEE 802.1AE MACsec
    • MACsec frame expansion: Inbuilt buffering and flow control support to handle 12 byte IPG ethernet frames
    • Authentication, encryption at line rate
    • Cipher suites: GCM-AES-XPN-128/256, GCM-AES-128/256
    • Secure Channel: Total 16 SAK enabling 8 Tx/Rx SC
    • Auto rollover support for SAK
    • Ingress/Egress classification for Ethertype, VLAN, DMAC: up to 8 parallel rules
    • Window replay protection
  • IEEE 802.1AS time synchronization
    • Highly accurate 1pps signal < +/-5 ns
    • Precise time stamping for MACsec encoded PTP packets
    • Multiple IOs for event capture and trigger
  • IEEE 802.3bw & OA 100BASE-T1 compliant
  • TC-10 compliant
    • < 20μA sleep current
    • Fast wake from sleep by retaining PHY configuration during sleep (optional)
  • MAC Interfaces: MII, RMII, RGMII, SGMII
  • Pin compatible with TI's 1000BASE-T1 PHY
    • Single board design for 100BASE-T1 and 1000BASE-T1 with required BOM change
  • Diagnostic tool kit
    • Signal Quality Indication (SQI) & Time Domain Reflectometry (TDR)
    • Voltage, Temperature & ESD sensors
  • AEC-Q100 qualified for Automotive Applications:
    • Temperature grade 1: –40°C to +125 °C