SLVSBN6A June   2013  – August 2015 DRV201A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Data Transmission Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 VCM Driver Output Stage Operation
      2. 7.3.2 Ringing Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C Bus Operation
        1. 7.5.1.1 Single Write to a Defined Location
        2. 7.5.1.2 Single Read from a Defined Location and Current Location
        3. 7.5.1.3 Sequential Read and Write
        4. 7.5.1.4 I2C Device Address, Start and Stop Condition
    6. 7.6 Register Maps
      1. 7.6.1 Control Register (Address - 0x02h)
      2. 7.6.2 VCM MSB Current Control Register (VCM_Current_MSB) Address - 0x03h
      3. 7.6.3 VCM LSB Current Control Register (VCM_Current_lSB) Address - 0x04h
      4. 7.6.4 Status Register (Status) Address - 0x05h
      5. 7.6.5 Mode Register (Mode) Address - 0x06h
      6. 7.6.6 VCM Resonance Frequency Register (VCM_FREQ) Address - 0x07h
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VCM Mechanical Ringing Frequency
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 User Example 1
        2. 8.2.2.2 User Example 2
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

YMB Package
6-Pin PicoStar
Bottom View
DRV201A po_01_slvsbn6.gif
YMB Package
6-Pin PicoStar
Top View
DRV201A po_02_slvsbn6.gif
YMB Package
6-Pin PicoStar
Top View
DRV201A po_03_slvsbn6.gif
The coated package option has a backside polymer coating that is 40µm thick. The final package heights of both the packages are the same for both options. This coating helps minimize edge chipping or die cracking during assembly and manufacturing.

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
VBAT 2A — Power
GND 1A — Ground
I_SOURCE 2B — Voice coil positive terminal
I_SINK 1B — Voice coil negative terminal
SCL 2C I I2C serial interface clock input
SDA 1C I/O I2C serial interface data input/output (open drain)