SLOS861B March   2015  – April 2015 DRV2700

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Boost + Amplifier Configuration
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Boost Converter and Control Loop
      2. 8.3.2 High-Voltage Amplifier
      3. 8.3.3 Fast Start-Up (Enable Pin)
      4. 8.3.4 Gain Control
      5. 8.3.5 Adjustable Boost Voltage
      6. 8.3.6 Adjustable Boost Current-Limit
      7. 8.3.7 Internal Charge Pump
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Boost + Amplifier Mode
      2. 8.4.2 Flyback Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 AC-Coupled DAC Input Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Piezo Load Selection
          2. 9.2.1.2.2  Programming The Boost Voltage
          3. 9.2.1.2.3  Inductor and Transformer Selection
          4. 9.2.1.2.4  Programing the Boost and Flyback Current-Limit
          5. 9.2.1.2.5  Boost Capacitor Selection
          6. 9.2.1.2.6  Pulldown FET and Resistors
          7. 9.2.1.2.7  Low-Voltage Operation
          8. 9.2.1.2.8  Current Consumption Calculation
          9. 9.2.1.2.9  Input Filter Considerations
          10. 9.2.1.2.10 Output Limiting Factors
          11. 9.2.1.2.11 Startup and Shutdown Sequencing
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Filtered AC Coupled Single-Ended PWM Input Application
      3. 9.2.3 DC-Coupled DAC Input Application
      4. 9.2.4 DC-Coupled Reference Input Application
      5. 9.2.5 Flyback Circuit
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Boost + Amplifier Configuration Layout Considerations
      2. 11.1.2 Flyback Configuration Layout Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

DRV2700EVM High Voltage Piezo Driver Evaluation Kit, SLOU403

12.2 Trademarks

All trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.