SLIS162H December   2014  – August 2018 DRV5013-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Output State
      2.      Device Packages
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
      6. 7.3.6 Overcurrent Protection (OCP)
      7. 7.3.7 Load Dump Protection
      8. 7.3.8 Reverse Supply Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • AEC-Q100 Qualified for Automotive Applications:
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C4B
    • Grade 1: TA = –40°C to 125°C (Q, See Device Nomenclature)
    • Grade 0: TA = –40°C to 150°C (E, See Device Nomenclature)
  • Digital Bipolar-Latch Hall Sensor
  • Superior Temperature Stability
    • BOP ±10% Over Temperature
  • Multiple Sensitivity Options (BOP / BRP)
  • Supports a Wide Voltage Range
    • 2.7 to 38 V
    • No External Regulator Required
  • Open-Drain Output (30-mA Sink)
  • Fast 35-µs Power-On Time
  • Small Package and Footprint
    • Surface Mount 3-Pin SOT-23 (DBZ)
      • 2.92 mm × 2.37 mm
    • Through-Hole 3-Pin TO-92 (LPG)
      • 4.00 mm × 3.15 mm
  • Protection Features
    • Reverse Supply Protection (up to –22 V)
    • Supports up to 40-V Load Dump
    • Output Short-Circuit Protection
    • Output Current Limitation
    • OUT Short to Battery Protection