SLIS162H December   2014  – August 2018 DRV5013-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Output State
      2.      Device Packages
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Magnetic Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Field Direction Definition
      2. 7.3.2 Device Output
      3. 7.3.3 Power-On Time
      4. 7.3.4 Output Stage
      5. 7.3.5 Protection Circuits
      6. 7.3.6 Overcurrent Protection (OCP)
      7. 7.3.7 Load Dump Protection
      8. 7.3.8 Reverse Supply Protection
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Standard Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Configuration Example
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Two-Wire Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Device Markings
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

TA > 125°C data is valid for Grade 0 devices only (E, see Figure 24)
DRV5013-Q1 D009_SLIS162.gif
Figure 1. ICC vs VCC
DRV5013-Q1 D001_SLIS150.gif
TA = 25°C
Figure 3. BOP vs VCC
DRV5013-Q1 D003_SLIS150.gif
TA = 25°C
Figure 5. BRP vs VCC
DRV5013-Q1 D007_SLIS150.gif
TA = 25°C
Figure 7. Hysteresis vs VCC
DRV5013-Q1 D005_SLIS150.gif
TA = 25°C
Figure 9. Offset vs VCC
DRV5013-Q1 D010_SLIS162.gif
Figure 2. ICC vs Temperature
DRV5013-Q1 D002_SLIS162.gif
VCC = 3.3 V
Figure 4. BOP vs Temperature
DRV5013-Q1 D004_SLIS162.gif
VCC = 3.3 V
Figure 6. BRP vs Temperature
DRV5013-Q1 D008_SLIS162.gif
VCC = 3.3 V
Figure 8. Hysteresis vs Temperature
DRV5013-Q1 D006_SLIS162.gif
VCC = 3.3 V
Figure 10. Offset vs Temperature