SLVSGC3 May   2020 DRV8210P

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 External Components
      2. 8.3.2 Control Modes
        1. 8.3.2.1 PWM Control
      3. 8.3.3 Protection Circuits
        1. 8.3.3.1 Supply Undervoltage Lockout (UVLO)
        2. 8.3.3.2 OUTx Overcurrent Protection (OCP)
        3. 8.3.3.3 Thermal Shutdown (TSD)
      4. 8.3.4 Pin Diagrams
        1. 8.3.4.1 Logic-Level Inputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Active Mode
      2. 8.4.2 Low-Power Sleep Mode
      3. 8.4.3 Fault Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Full-Bridge Driving
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Supply Voltage
          2. 9.2.1.2.2 Control Interface
          3. 9.2.1.2.3 Low-Power Operation
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual-Coil Relay Driving
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Supply Voltage
          2. 9.2.2.2.2 Control Interface
          3. 9.2.2.2.3 Low-Power Operation
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Current Sense
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Shunt Resistor Sizing
    3. 9.3 Current Capability and Thermal Performance
      1. 9.3.1 Power Dissipation and Output Current Capability
      2. 9.3.2 Thermal Performance
        1. 9.3.2.1 Steady-State Thermal Performance
        2. 9.3.2.2 Transient Thermal Performance
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) DRV8210P UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 99.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 119.9 °C/W
RθJB Junction-to-board thermal resistance 66.3 °C/W
ΨJT Junction-to-top characterization parameter 13.9 °C/W
ΨJB Junction-to-board characterization parameter 66.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 43.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.