SLVS855K July   2008  – March 2021 DRV8800 , DRV8801

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Logic Inputs
      2. 8.3.2  VREG (DRV8800 Only)
      3. 8.3.3  VPROPI (DRV8801 Only)
        1. 8.3.3.1 Connecting VPROPI Output to ADC
      4. 8.3.4  Charge Pump
      5. 8.3.5  Shutdown
      6. 8.3.6  Low-Power Mode
      7. 8.3.7  Braking
      8. 8.3.8  Diagnostic Output
      9. 8.3.9  Thermal Shutdown (TSD)
      10. 8.3.10 Overcurrent Protection
      11. 8.3.11 SENSE
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Operation
        1. 8.4.1.1 Slow-Decay SR (Brake Mode)
        2. 8.4.1.2 Fast Decay With Synchronous Rectification
          1. 8.4.1.2.1
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Motor Voltage
        2. 9.2.2.2 Power Dissipation
        3. 9.2.2.3 Thermal Considerations
          1. 9.2.2.3.1 Junction-to-Ambiant Thermal Impedance (ƟJA)
        4. 9.2.2.4 Motor Current Trip Point
        5. 9.2.2.5 Sense Resistor Selection
        6. 9.2.2.6 Drive Current
      3. 9.2.3 Pulse-Width Modulating
        1. 9.2.3.1 Pulse-Width Modulating ENABLE
        2. 9.2.3.2 Pulse-Width Modulating PHASE
      4. 9.2.4 Application Curves
    3. 9.3 Parallel Configuration
      1. 9.3.1 Parallel Connections
      2. 9.3.2 Non – Parallel Connections
      3. 9.3.3 Wiring nFAULT as Wired OR
      4. 9.3.4 Electrical Considerations
        1. 9.3.4.1 Device Spacing
        2. 9.3.4.2 Recirculation Current Handling
        3. 9.3.4.3 Sense Resistor Selection
        4. 9.3.4.4 Maximum System Current
  10. 10Power Supply Recommendations
    1. 10.1 Bulk Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
IBBMotor supply currentfPWM < 50 kHz6mA
Charge pump on, Outputs disabled3.2
Sleep mode10μA
VIHPHASE, ENABLE,
MODE input voltage
2V
VIL0.8
VIHnSLEEP input voltage2.7V
VIL0.8
IIHPHASE, MODE input currentVIN = 2 V<1.020μA
IILVIN = 0.8 V–20≤–2.020
IIHENABLE input currentVIN = 2 V40100μA
IILVIN = 0.8 V1640
IIHnSLEEP input currentVIN = 2.7 V2750μA
IILVIN = 0.8 V<110
VOLnFAULT output voltageIsink = 1 mA0.4V
VBBNFRVBB nFAULT release8 V < VBB < 40 V1213.8V
VIHysInput hysteresis, except nSLEEP100500800mV
rDS(on)Output ON-resistanceSource driver, IOUT = –2.8 A, TJ = 25°C0.48
Source driver, IOUT = –2.8 A, TJ = 125°C0.740.85
Sink driver, IOUT = 2.8 A, TJ = 25°C0.35
Sink driver, IOUT = 2.8 A, TJ = 125°C0.520.7
VTRPRSENSE voltage tripSENSE connected to ground through a 0.2-Ω resistor500mV
VfBody diode forward voltageSource diode, If = –2.8 A1.4V
Sink diode, If = 2.8 A1.4
tpdPropagation delay timePWM, Change to source or sink ON600ns
PWM, Change to source or sink OFF100
tCODCrossover delay500ns
DAGainDifferential AMP gainSense = 0.1 V to 0.4 V5V/V
PROTECTION CIRCUITRY
VUVUVLO thresholdVBB increasing6.57.5V
IOCPOvercurrent threshold3A
tDEGOvercurrent deglitch time3µs
tOCPOvercurrent retry time1.2ms
TJWThermal warning temperatureTemperature increasing(1)160°C
TJTSDThermal shutdown temperatureTemperature increasing(2)175°C
After the device reaches the thermal warning temperature of 160°C, the device will remain in thermal warning until the device cools to 145°C. This is known as the device's thermal warning hysteresis.
After the device reaches the thermal shutdown temperature of 175°C, the device will remain in thermal shutdown until the device cools to 160°C. This is known as the device's thermal shutdown hysteresis.