SLVS855J July   2008  – March 2015 DRV8800 , DRV8801

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  Logic Inputs
      2. 9.3.2  VREG (DRV8800 Only)
      3. 9.3.3  VPROPI (DRV8801 Only)
      4. 9.3.4  Charge Pump
      5. 9.3.5  Shutdown
      6. 9.3.6  Low-Power Mode
      7. 9.3.7  Braking
      8. 9.3.8  Diagnostic Output
      9. 9.3.9  Thermal Shutdown (TSD)
      10. 9.3.10 Overcurrent Protection
      11. 9.3.11 SENSE
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device Operation
        1. 9.4.1.1 Slow-Decay SR (Brake Mode)
        2. 9.4.1.2 Fast Decay With Synchronous Rectification
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Motor Voltage
        2. 10.2.2.2 Power Dissipation
        3. 10.2.2.3 Motor Current Trip Point
        4. 10.2.2.4 Sense Resistor Selection
        5. 10.2.2.5 Drive Current
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Bulk Capacitance
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VBB Load supply voltage(2) –0.3 40 V
Output current –2.8 2.8 A
VSense Sense voltage –500 500 mV
VBB to OUTx 36 V
OUTx to SENSE 36 V
VDD Logic input voltage(2) –0.3 7 V
Continuous total power dissipation See Thermal Information
TA Operating free-air temperature –40 85 °C
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage, VBB 8 32 38 V
TA Operating free-air temperature –40 85 °C

7.4 Thermal Information

THERMAL METRIC(1) DRV880x UNIT
RTY (WQFN) PWP (HTSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 38.1 43.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36.7 30.8
RθJB Junction-to-board thermal resistance 16.1 25.3
ψJT Junction-to-top characterization parameter 0.3 1.1
ψJB Junction-to-board characterization parameter 16.2 25
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.1 5.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IBB Motor supply current fPWM < 50 kHz 6 mA
Charge pump on, Outputs disabled 3.2
Sleep mode 10 μA
VIH PHASE, ENABLE,
MODE input voltage
2 V
VIL 0.8
VIH nSLEEP input voltage 2.7 V
VIL 0.8
IIH PHASE, MODE input current VIN = 2 V <1.0 20 μA
IIL VIN = 0.8 V –20 ≤–2.0 20
IIH ENABLE input current VIN = 2 V 40 100 μA
IIL VIN = 0.8 V 16 40
IIH nSLEEP input current VIN = 2.7 V 27 50 μA
IIL VIN = 0.8 V <1 10
VOL nFAULT output voltage Isink = 1 mA 0.4 V
VBBNFR VBB nFAULT release 8 V < VBB < 40 V 12 13.8 V
VIHys Input hysteresis, except nSLEEP 100 500 800 mV
rDS(on) Output ON-resistance Source driver, IOUT = –2.8 A, TJ = 25°C 0.48 Ω
Source driver, IOUT = –2.8 A, TJ = 125°C 0.74 0.85
Sink driver, IOUT = 2.8 A, TJ = 25°C 0.35
Sink driver, IOUT = 2.8 A, TJ = 125°C 0.52 0.7
VTRP RSENSE voltage trip SENSE connected to ground through a 0.2-Ω resistor 500 mV
Vf Body diode forward voltage Source diode, If = –2.8 A 1.4 V
Sink diode, If = 2.8 A 1.4
tpd Propagation delay time PWM, Change to source or sink ON 600 ns
PWM, Change to source or sink OFF 100
tCOD Crossover delay 500 ns
DAGain Differential AMP gain Sense = 0.1 V to 0.4 V 5 V/V
PROTECTION CIRCUITRY
VUV UVLO threshold VBB increasing 6.5 7.5 V
IOCP Overcurrent threshold 3 A
tDEG Overcurrent deglitch time 3 µs
tOCP Overcurrent retry time 1.2 ms
TJW Thermal warning temperature Temperature increasing(1) 160 °C
TJTSD Thermal shutdown temperature Temperature increasing(2) 175 °C
(1) After the device reaches the thermal warning temperature of 160°C, the device will remain in thermal warning until the device cools to 145°C. This is known as the device's thermal warning hysteresis.
(2) After the device reaches the thermal shutdown temperature of 175°C, the device will remain in thermal shutdown until the device cools to 160°C. This is known as the device's thermal shutdown hysteresis.

7.6 Typical Characteristics

DRV8800 DRV8801 C001_SLRS063.png
Figure 1. IVBBQ vs VBB
DRV8800 DRV8801 C003_SLRS063.png
Figure 3. VCP vs VBB
DRV8800 DRV8801 C002_SLRS063.png
Figure 2. RDS(ON) vs VBB (Normalized to VBB = 8 V)