SLVSBN4C January   2013  – August 2016 DRV8839

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Protection Circuits
        1. 7.3.1.1 Overcurrent Protection (OCP)
        2. 7.3.1.2 Thermal Shutdown (TSD)
        3. 7.3.1.3 Undervoltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Bridge Control
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Motor Connections
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Motor Voltage
        2. 8.2.2.2 Low-Power Operation
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (December 2015) to C Revision

  • Deleted nFAULT from the Simplified SchematicGo
  • Deleted the NC pins from the Pin Functions tableGo
  • Changed the value of the capacitor on the VM pin from 10 µF to 0.1 µF in the Typical Application SchematicGo
  • Changed the Layout Guidelines to clarify the guidelines for the VM pinGo
  • Deleted references to TI's PowerPAD package and updated it with thermal pad where applicableGo
  • Added the Receiving Notification of Documentation Updates section Go

Changes from A Revision (January 2014) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (January 2013) to A Revision

  • Changed Features bulletGo
  • Changed motor supply voltage range in Description sectionGo
  • Changed Motor power supply voltage range in Recommended Operating Conditions Go
  • Added tOCR and tDEAD parameters to Electrical CharacteristicsGo
  • Added paragraph to Power Supplies and Input Pins sectionGo