SLIS175 November 2016 DRV8872-Q1

PRODUCTION DATA.

- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

- DDA|8

- DDA|8

Power dissipation in the DRV8872-Q1 device is dominated by the power dissipated in the output FET resistance, R_{DS(on)}. Use Equation 2 from the *Drive Current* section to calculate the estimated average power dissipation of when driving a load.

Note that at startup, the output current is much higher than normal running current; this peak current and its duration must be also be considered.

The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking.

NOTE

R_{DS(on)} increases with temperature, so as the device heats, the power dissipation increases. This fact must be taken into consideration when sizing the heatsink.

The power dissipation of the DRV8872-Q1 is a function of RMS motor current and the FET resistance (R_{DS(ON)}) of each output.

Equation 3.

For this example, the ambient temperature is 58°C, and the junction temperature reaches 80°C. At 58°C, the sum of R_{DS(ON)} is about 0.72 Ω. With an example motor current of 0.8 A, the dissipated power in the form of heat is 0.8 A^{2} × 0.72 Ω = 0.46 W.

The temperature that the DRV8872-Q1 reaches depends on the thermal resistance to the air and PCB. Soldering the device PowerPAD to the PCB ground plane, with vias to the top and bottom board layers, is important to dissipate heat into the PCB and reduce the device temperature. In the example used here, the DRV8872-Q1 had an effective thermal resistance R_{θJA} of 48°C/W, and a T_{J} value as shown in Equation 4.

Equation 4.