SNLS457B November   2014  – August 2019 DS90UB929-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Application Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 Power Down (PDB)
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Interrupt Pin (INTB)
      13. 7.3.13 Remote Interrupt Pin (REM_INTB)
      14. 7.3.14 General-Purpose I/O
        1. 7.3.14.1 GPIO[3:0] Configuration
        2. 7.3.14.2 GPIO_REG[8:5] Configuration
      15. 7.3.15 Backward Compatibility
      16. 7.3.16 Audio Modes
        1. 7.3.16.1 HDMI Audio
        2. 7.3.16.2 DVI I2S Audio Interface
          1. 7.3.16.2.1 I2S Transport Modes
          2. 7.3.16.2.2 I2S Repeater
        3. 7.3.16.3 AUX Audio Channel
        4. 7.3.16.4 TDM Audio Interface
      17. 7.3.17 Built-In Self Test (BIST)
        1. 7.3.17.1 BIST Configuration And Status
        2. 7.3.17.2 Forward Channel and Back Channel Error Checking
      18. 7.3.18 Internal Pattern Generation
        1. 7.3.18.1 Pattern Options
        2. 7.3.18.2 Color Modes
        3. 7.3.18.3 Video Timing Modes
        4. 7.3.18.4 External Timing
        5. 7.3.18.5 Pattern Inversion
        6. 7.3.18.6 Auto Scrolling
        7. 7.3.18.7 Additional Features
      19. 7.3.19 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Single Link Operation
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Internal Pre-Programmed EDID

The serializer also has an internal eFuse that is loaded into the internal SRAM with pre-programmed 256-byte EDID data at start-up. This EDID profile supports several generic video (480p, 720p) and audio (2-channel audio) timing profiles within the single-link operating range of the device (25-MHz to 96-MHz pixel clock). In this mode, the internal EDID SRAM data is readable from the DDC interface. The EDID contents are below:

0x00 0xFF 0xFF 0xFF 0xFF 0xFF 0xFF 0x00 0x53 0x0E 0x49 0x09 0x01 0x00 0x00 0x00
0x1C 0x18 0x01 0x03 0x80 0x34 0x20 0x78 0x0A 0xEC 0x18 0xA3 0x54 0x46 0x98 0x25
0x0F 0x48 0x4C 0x00 0x00 0x00 0x01 0x01 0x01 0x01 0x01 0x01 0x01 0x01 0x01 0x01
0x01 0x01 0x01 0x01 0x01 0x01 0x01 0x1D 0x00 0x72 0x51 0xD0 0x1E 0x20 0x6E 0x50
0x55 0x00 0x00 0x20 0x21 0x00 0x00 0x18 0x00 0x00 0x00 0xFD 0x00 0x3B 0x3D 0x62
0x64 0x08 0x00 0x0A 0x20 0x20 0x20 0x20 0x20 0x20 0x00 0x00 0x00 0xFC 0x00 0x54
0x49 0x2D 0x44 0x53 0x39 0x30 0x55 0x78 0x39 0x34 0x39 0x0A 0x00 0x00 0x00 0x10
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x01 0x57
0x02 0x03 0x15 0x40 0x41 0x84 0x23 0x09 0x7F 0x05 0x83 0x01 0x00 0x00 0x66 0x03
0x0C 0x00 0x10 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00
0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x28