SLVSGS4C
September 2022 – December 2022
ESD1LIN24-Q1
,
ESD751-Q1
,
ESD761-Q1
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings—AEC Specification
6.3
ESD Ratings—IEC Specification
6.4
ESD Ratings - ISO Specification
6.5
Recommended Operating Conditions
6.6
Thermal Information
6.7
Electrical Characteristics
6.8
Typical Characteristics – ESD751
6.9
Typical Characteristics – ESD1LIN24
6.10
Typical Characteristics - ESD761
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
IEC 61000-4-5 Surge Protection
7.3.2
IO Capacitance
7.3.3
Dynamic Resistance
7.3.4
DC Breakdown Voltage
7.3.5
Ultra Low Leakage Current
7.3.6
Clamping Voltage
7.3.7
Industry Standard Packages
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Support Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPY|2
MPSS034C
Thermal pad, mechanical data (Package|Pins)
DPY|2
QFND429B
Orderable Information
slvsgs4c_oa
slvsgs4c_pm
5
Pin Configuration and Functions
Figure 5-1
DPY Package, 2-Pin X1SON (Top View).
Figure 5-2
DYF Package, 2-Pin SOD-323 (Top View)
Table 5-1 Pin Functions
PIN
TYPE
(1)
DESCRIPTION
NAME
NO.
IO
1
I/O
ESD protected IO
GND
2
G
Connect to ground.
(1)
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.