SPRS825E October   2012  – December 2017 F28M36H33B2 , F28M36H53B2 , F28M36P53C2 , F28M36P63C2

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for ZWT Package (Revision 0 Silicon)
    7. 5.7  Thermal Resistance Characteristics for ZWT Package (Revision A Silicon)
    8. 5.8  Thermal Design Considerations
    9. 5.9  Timing and Switching Characteristics
      1. 5.9.1 Power Sequencing
        1. 5.9.1.1 Power Management and Supervisory Circuit Solutions
      2. 5.9.2 Clock Specifications
        1. 5.9.2.1 Changing the Frequency of the Main PLL
        2. 5.9.2.2 Input Clock Frequency and Timing Requirements, PLL Lock Times
        3. 5.9.2.3 Output Clock Frequency and Switching Characteristics
        4. 5.9.2.4 Internal Clock Frequencies
      3. 5.9.3 Timing Parameter Symbology
        1. 5.9.3.1 General Notes on Timing Parameters
        2. 5.9.3.2 Test Load Circuit
      4. 5.9.4 Flash Timing - Master Subsystem
      5. 5.9.5 Flash Timing - Control Subsystem
      6. 5.9.6 GPIO Electrical Data and Timing
        1. 5.9.6.1 GPIO - Output Timing
        2. 5.9.6.2 GPIO - Input Timing
        3. 5.9.6.3 Sampling Window Width for Input Signals
        4. 5.9.6.4 Low-Power Mode Wakeup Timing
      7. 5.9.7 External Interrupt Electrical Data and Timing
    10. 5.10 Analog and Shared Peripherals
      1. 5.10.1 Analog-to-Digital Converter
        1. 5.10.1.1 Sample Mode
        2. 5.10.1.2 Start-of-Conversion Triggers
        3. 5.10.1.3 Analog Inputs
        4. 5.10.1.4 ADC Result Registers and EOC Interrupts
        5. 5.10.1.5 ADC Electrical Data and Timing
      2. 5.10.2 Comparator + DAC Units
        1. 5.10.2.1 On-Chip Comparator and DAC Electrical Data and Timing
      3. 5.10.3 Interprocessor Communications
      4. 5.10.4 External Peripheral Interface
        1. 5.10.4.1 EPI General-Purpose Mode
        2. 5.10.4.2 EPI SDRAM Mode
        3. 5.10.4.3 EPI Host Bus Mode
          1. 5.10.4.3.1 EPI 8-Bit Host Bus (HB-8) Mode
            1. 5.10.4.3.1.1 HB-8 Muxed Address/Data Mode
            2. 5.10.4.3.1.2 HB-8 Non-Muxed Address/Data Mode
            3. 5.10.4.3.1.3 HB-8 FIFO Mode
          2. 5.10.4.3.2 EPI 16-Bit Host Bus (HB-16) Mode
            1. 5.10.4.3.2.1 HB-16 Muxed Address/Data Mode
            2. 5.10.4.3.2.2 HB-16 Non-Muxed Address/Data Mode
            3. 5.10.4.3.2.3 HB-16 FIFO Mode
        4. 5.10.4.4 EPI Electrical Data and Timing
    11. 5.11 Master Subsystem Peripherals
      1. 5.11.1 Synchronous Serial Interface
        1. 5.11.1.1 Bit Rate Generation
        2. 5.11.1.2 Transmit FIFO
        3. 5.11.1.3 Receive FIFO
        4. 5.11.1.4 Interrupts
        5. 5.11.1.5 Frame Formats
      2. 5.11.2 Universal Asynchronous Receiver/Transmitter
        1. 5.11.2.1 Baud-Rate Generation
        2. 5.11.2.2 Transmit and Receive Logic
        3. 5.11.2.3 Data Transmission and Reception
        4. 5.11.2.4 Interrupts
      3. 5.11.3 Cortex-M3 Inter-Integrated Circuit
        1. 5.11.3.1 Functional Overview
        2. 5.11.3.2 Available Speed Modes
        3. 5.11.3.3 I2C Electrical Data and Timing
      4. 5.11.4 Cortex-M3 Controller Area Network
        1. 5.11.4.1 Functional Overview
      5. 5.11.5 Cortex-M3 Universal Serial Bus Controller
        1. 5.11.5.1 Functional Description
      6. 5.11.6 Cortex-M3 Ethernet Media Access Controller
        1. 5.11.6.1 Functional Overview
        2. 5.11.6.2 MII Signals
        3. 5.11.6.3 EMAC Electrical Data and Timing
        4. 5.11.6.4 MDIO Electrical Data and Timing
    12. 5.12 Control Subsystem Peripherals
      1. 5.12.1 High-Resolution PWM and Enhanced PWM Modules
        1. 5.12.1.1 HRPWM Electrical Data and Timing
        2. 5.12.1.2 ePWM Electrical Data and Timing
          1. 5.12.1.2.1 Trip-Zone Input Timing
      2. 5.12.2 Enhanced Capture Module
        1. 5.12.2.1 eCAP Electrical Data and Timing
      3. 5.12.3 Enhanced Quadrature Encoder Pulse Module
        1. 5.12.3.1 eQEP Electrical Data and Timing
      4. 5.12.4 C28x Inter-Integrated Circuit Module
        1. 5.12.4.1 Functional Overview
        2. 5.12.4.2 Clock Generation
        3. 5.12.4.3 I2C Electrical Data and Timing
      5. 5.12.5 C28x Serial Communications Interface
        1. 5.12.5.1 Architecture
        2. 5.12.5.2 Multiprocessor and Asynchronous Communication Modes
      6. 5.12.6 C28x Serial Peripheral Interface
        1. 5.12.6.1 Functional Overview
        2. 5.12.6.2 SPI Electrical Data and Timing
          1. 5.12.6.2.1 Master Mode Timing
          2. 5.12.6.2.2 Slave Mode Timing
      7. 5.12.7 C28x Multichannel Buffered Serial Port
        1. 5.12.7.1 McBSP Electrical Data and Timing
          1. 5.12.7.1.1 McBSP Transmit and Receive Timing
          2. 5.12.7.1.2 McBSP as SPI Master or Slave Timing
  6. 6Detailed Description
    1. 6.1  Memory Maps
      1. 6.1.1 Control Subsystem Memory Map
      2. 6.1.2 Master Subsystem Memory Map
    2. 6.2  Identification
    3. 6.3  Master Subsystem
      1. 6.3.1 Cortex-M3 CPU
      2. 6.3.2 Cortex-M3 DMA and NVIC
      3. 6.3.3 Cortex-M3 Interrupts
      4. 6.3.4 Cortex-M3 Vector Table
      5. 6.3.5 Cortex-M3 Local Peripherals
      6. 6.3.6 Cortex-M3 Local Memory
      7. 6.3.7 Cortex-M3 Accessing Shared Resources and Analog Peripherals
    4. 6.4  Control Subsystem
      1. 6.4.1 C28x CPU/FPU/VCU
      2. 6.4.2 C28x Core Hardware Built-In Self-Test
      3. 6.4.3 C28x Peripheral Interrupt Expansion
      4. 6.4.4 C28x Direct Memory Access
      5. 6.4.5 C28x Local Peripherals
      6. 6.4.6 C28x Local Memory
      7. 6.4.7 C28x Accessing Shared Resources and Analog Peripherals
    5. 6.5  Analog Subsystem
      1. 6.5.1 ADC1
      2. 6.5.2 ADC2
      3. 6.5.3 Analog Comparator + DAC
      4. 6.5.4 Analog Common Interface Bus
    6. 6.6  Master Subsystem NMIs
    7. 6.7  Control Subsystem NMIs
    8. 6.8  Resets
      1. 6.8.1 Cortex-M3 Resets
      2. 6.8.2 C28x Resets
      3. 6.8.3 Analog Subsystem and Shared Resources Resets
      4. 6.8.4 Device Boot Sequence
    9. 6.9  Internal Voltage Regulation and Power-On-Reset Functionality
      1. 6.9.1 Analog Subsystem: Internal 1.8-V VREG
      2. 6.9.2 Digital Subsystem: Internal 1.2-V VREG
      3. 6.9.3 Analog and Digital Subsystems: Power-On-Reset Functionality
      4. 6.9.4 Connecting ARS and XRS Pins
    10. 6.10 Input Clocks and PLLs
      1. 6.10.1 Internal Oscillator (Zero-Pin)
      2. 6.10.2 Crystal Oscillator/Resonator (Pins X1/X2 and VSSOSC)
      3. 6.10.3 External Oscillators (Pins X1, VSSOSC, XCLKIN)
      4. 6.10.4 Main PLL
      5. 6.10.5 USB PLL
    11. 6.11 Master Subsystem Clocking
      1. 6.11.1 Cortex-M3 Run Mode
      2. 6.11.2 Cortex-M3 Sleep Mode
      3. 6.11.3 Cortex-M3 Deep Sleep Mode
    12. 6.12 Control Subsystem Clocking
      1. 6.12.1 C28x Normal Mode
      2. 6.12.2 C28x IDLE Mode
      3. 6.12.3 C28x STANDBY Mode
    13. 6.13 Analog Subsystem Clocking
    14. 6.14 Shared Resources Clocking
    15. 6.15 Loss of Input Clock (NMI Watchdog Function)
    16. 6.16 GPIOs and Other Pins
      1. 6.16.1 GPIO_MUX1
      2. 6.16.2 GPIO_MUX2
      3. 6.16.3 AIO_MUX1
      4. 6.16.4 AIO_MUX2
    17. 6.17 Emulation/JTAG
    18. 6.18 Code Security Module
      1. 6.18.1 Functional Description
    19. 6.19 µCRC Module
      1. 6.19.1 Functional Description
      2. 6.19.2 CRC Polynomials
      3. 6.19.3 CRC Calculation Procedure
      4. 6.19.4 CRC Calculation for Data Stored In Secure Memory
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Device and Development Support Tool Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Related Links
    5. 8.5 Community Resources
    6. 8.6 Trademarks
    7. 8.7 Electrostatic Discharge Caution
    8. 8.8 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ZWT|289
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all Concerto MCU devices and support tools. Each Concerto MCU commercial family member has one of three prefixes: x, p, or no prefix (for example, xF28M36P63C2ZWTT). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (with prefix x for devices and TMDX for tools) through fully qualified production devices/tools (with no prefix for devices and TMDS, instead of TMDX, for tools).

xF28M36... Experimental device that is not necessarily representative of the final device's electrical specifications
pF28M36... Final silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification
F28M36... Fully qualified production device

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing
TMDS Fully qualified development-support product

Devices with prefix x or p and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices with prefix of x or p have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, ZWT) and temperature range (for example, T).

For device part numbers and further ordering information of F28M36x devices in the ZWT package type, see the TI website (www.ti.com) or contact your TI sales representative.

For additional description of the device nomenclature markings on the die, see the F28M36x Concerto™ MCUs Silicon Errata.

F28M36P63C2 F28M36P53C2 F28M36H53C2 F28M36H53B2 F28M36H33C2 F28M36H33B2 nomenclature_prs820.gif
The additional 256KB is added to the Cortex-M3 core (connectivity devices) or to the C28x core (base devices).
Figure 8-1 Device Nomenclature

Tools and Software

TI offers an extensive line of development tools. Some of the tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below. To view all available tools and software for C2000™ real-time control MCUs, visit the C2000 MCU Tools and Software page.

Development Tools

H63C2 Concerto Experimenter Kit
The C2000 Experimenter Kits from Texas Instruments are ideal products for initial device exploration and testing. The Concerto H63C2 Experimenter Kit has a docking station that features access to all controlCARD signals, breadboard areas and RS-232 and JTAG connectors. Each kit contains a H63C2 controlCARD. The controlCARD is a complete board level module that utilizes and industry-standard DIMM form factor to provide a low-profiles single-board controller solution. Kit is complete with Code Composer StudioTM IDE v5 and USB cable.

F28M36 Concerto Control Card
The C2000 controlCARDs from Texas Instruments are ideal products for initial software development and short run builds for system prototypes, test stands, and many other projects that require easy access to high-performance controllers. The controlCARDs are complete board-level modules that utilize an industry-standard DIMM form factor to provide a low-profile single-board controller solution. The host system needs to provide only a single 5V power rail to the controlCARD for it to be fully functional.

Software Tools

controlSUITE™ Software Suite: Essential Software and Development Tools for C2000™ Microcontrollers
controlSUITE™ for C2000™ microcontrollers is a cohesive set of software infrastructure and software tools designed to minimize software development time.

Code Composer Studio™ (CCS) Integrated Development Environment (IDE) for C2000 Microcontrollers
Code Composer Studio is an integrated development environment (IDE) that supports TI's Microcontroller and Embedded Processors portfolio. Code Composer Studio comprises a suite of tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source code editor, project build environment, debugger, profiler, and many other features. The intuitive IDE provides a single user interface taking the user through each step of the application development flow. Familiar tools and interfaces allow users to get started faster than ever before. Code Composer Studio combines the advantages of the Eclipse software framework with advanced embedded debug capabilities from TI resulting in a compelling feature-rich development environment for embedded developers.

F021 Flash API
The F021 Flash Application Programming Interface (API) provides a software library of functions to program, erase, and verify F021 on-chip Flash memory.

Models

Various models are available for download from the product Tools & Software pages. These include I/O Buffer Information Specification (IBIS) Models and Boundary-Scan Description Language (BSDL) Models. To view all available models, visit the Models section of the Tools & Software page for each device, which can be found in Table 8-1.

Training

For support and training, go to http://www.ti.com/product/F28M36P63C2/support.

Documentation Support

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

The current documentation that describes the processor, related peripherals, and other technical collateral is listed below.

Errata

F28M36x Concerto™ MCUs Silicon Errata describes known advisories on silicon and provides workarounds.

Technical Reference Manual

Concerto F28M36x Technical Reference Manual details the integration, the environment, the functional description, and the programming models for each peripheral and subsystem in the F28M36x Microcontroller Processors.

CPU User's Guides

TMS320C28x CPU and Instruction Set Reference Guide describes the central processing unit (CPU) and the assembly language instructions of the TMS320C28x fixed-point digital signal processors (DSPs). This Reference Guide also describes emulation features available on these DSPs.

TMS320C28x Extended Instruction Sets Technical Reference Manual describes the architecture, pipeline, and instruction set of the TMU, VCU-II, and FPU accelerators.

Peripheral Guides

C2000 Real-Time Control Peripherals Reference Guide describes the peripheral reference guides of the 28x DSPs.

Tools Guides

TMS320C28x Assembly Language Tools v17.9.0.STS User's Guide describes the assembly language tools (assembler and other tools used to develop assembly language code), assembler directives, macros, common object file format, and symbolic debugging directives for the TMS320C28x device.

TMS320C28x Optimizing C/C++ Compiler v17.9.0.STS User's Guide describes the TMS320C28x C/C++ compiler. This compiler accepts ANSI standard C/C++ source code and produces TMS320 DSP assembly language source code for the TMS320C28x device.

TMS320C28x Instruction Set Simulator Technical Overview describes the simulator, available within the Code Composer Studio for TMS320C2000 IDE, that simulates the instruction set of the C28x core.

Application Reports

Semiconductor and IC Package Thermal Metrics describes traditional and new thermal metrics and puts their application in perspective with respect to system-level junction temperature estimation.

Semiconductor Packing Methodology describes the packing methodologies employed to prepare semiconductor devices for shipment to end users.

Calculating Useful Lifetimes of Embedded Processors provides a methodology for calculating the useful lifetime of TI embedded processors (EPs) under power when used in electronic systems. It is aimed at general engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement.

An Introduction to IBIS (I/O Buffer Information Specification) Modeling discusses various aspects of IBIS including its history, advantages, compatibility, model generation flow, data requirements in modeling the input/output structures and future trends.

Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 8-1 Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
F28M36P63C2 Click here Click here Click here Click here Click here
F28M36P53C2 Click here Click here Click here Click here Click here
F28M36H53C2 Click here Click here Click here Click here Click here
F28M36H53B2 Click here Click here Click here Click here Click here
F28M36H33C2 Click here Click here Click here Click here Click here
F28M36H33B2 Click here Click here Click here Click here Click here

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

Trademarks

TMS320C2000, Piccolo, Delfino, controlSUITE, Texas Instruments, Code Composer Studio, C2000, E2E are trademarks of Texas Instruments.

ARM, Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and.

Freescale is a trademark of Freescale Semiconductor, Inc.

NXP is a registered trademark of NXP Semiconductors.

Bosch is a registered trademark of Robert Bosch GmbH Corporation.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.