9 Revision History
Changes from Revision A (March 2025) to Revision B (January 2026)
- Added different fabrication process specification for slew rate in
the Features
Go
- Added description of device flow information in
Specifications
Go
- Added all chip site origins (CSO) condition to the typical test conditions in the Electrical Characteristics
Go
- Changed output voltage typical from "(V+) - 0.8" to "(V-) - 0.8" in the Electrical Characteristics
Go
- Added different fabrication process specifications for short circuit current, sinking and sourcing, in the Electrical Characteristics
Go
- Separated sinking and sourcing for short circuit current in the Electrical CharacteristicsGo
- Changed 0.01% settling time test condition from "CL = 1000pF" to "CL = 100pF" in the Electrical CharacteristicsGo
- Changed quiescent current test condition from "IO = 0V" to "IO = 0A" in the Electrical Characteristics
Go
- Added "CSO:SHE" to Total Harmonic Distortion + Noise vs Frequency,
Voltage Noise Density vs Frequency, Slew Rate vs Temperature, Short-Circuit
Current vs Temperature, Output Voltage Swing vs Output Current, and Large-Signal
Step Response in the Typical Characteristics
Go
- Added Total Harmonic Distortion + Noise vs Frequency, Voltage Noise
Density vs Frequency, Output Voltage Swing vs Output Current (Sinking), Output
Voltage Swing vs Output Current (Sourcing), and Large-Signal Step Response in
the Typical Characteristics
Go
- Added all chip site origins (CSO) condition to the typical test conditions in the
Typical Characteristics
Go
- Change and added INA133 Internal Schematic for each fabrication
process in the Functional Block Diagram
Go
- Changed "INA105" to "INA133" in the Power Supply
Recommendations
Go
Changes from Revision * (June 1999) to Revision A (March 2025)
- Updated the numbering and format for tables, figures, and
cross-references throughout the documentGo
- Added the Pin Configuration and Functions, Specifications,
Recommended Operating Conditions, Thermal Information, Detailed Description,
Overview, Functional Block Diagram, Feature Description, Device Functional
Modes, Application and Implementation, Power Supply Recommendations, Layout,
Layout Guidelines, Layout Example, Device and Documentation Support, and
Mechanical, Packaging, and Orderable Information sectionsGo
- Changed the Package Information tableGo
- Added Pin Functions table for INA133 and INA2133Go
- Added test conditions to Electrical Characteristics tableGo
- Combined VS=±15V and VS=±5V specification table in Electrical Characteristics
Go
- Changed parameter name in Electrical Characteristics from Offset Voltage Initial vs Temperature to Offset voltage drift
Go
- Changed parameter name in Electrical Characteristics from Offset Voltage Initial vs Power Supply to Power supply rejection ratio
Go
- Changed parameter name in Electrical Characteristics from Offset Voltage vs Time to Long-term stability
Go
- Changed parameter name in Electrical Characteristics from Current Limit, Continous-to-Common to Short-circuit current and added test condition Go
- Moved the power supply and temperature ranges from the Electrical Characteristics table to the Recommended Operating
Conditions and Absolute Maximum Ratings tableGo
- Changed the Applications sectionGo