SBOS109A September   1999  – November 2023 INA146

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = ±2.25 V to ±18 V
    6. 5.6 Electrical Characteristics VS = 5 V Single Supply
    7. 5.7 Amplifier A1, A2 Performance
    8. 5.8 Typical Performance Curves
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Setting the Gain
      3. 6.1.3 Common-mode Range
      4. 6.1.4 Offset Trim
      5. 6.1.5 Input Impedance
  8. 7Device and Documentation Support
    1. 7.1 Third-Party Products Disclaimer
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) INA146 UNIT
SO-8
8 PINS
RθJA Junction-to-ambient thermal resistance 110.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.6 °C/W
RθJB Junction-to-board thermal resistance 55.5 °C/W
ψJT Junction-to-top characterization parameter 6.2 °C/W
ψJB Junction-to-board characterization parameter 54.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.