SBOS122E December   1999  – December 2017 INA138 , INA168

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Range
      2. 7.3.2 Bandwidth
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Operation
    2. 8.2 Typical Applications
      1. 8.2.1 Buffering Output to Drive an ADC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Selecting the Shunt Resistor and RL
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Output Filter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Offsetting the Output Voltage
      4. 8.2.4 Bipolar Current Measurement
      5. 8.2.5 Bipolar Current Measurement Using Differential Input of ADC
      6. 8.2.6 Multiplexed Measurement Using Logic Signal for Power
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from D Revision (December 2014) to E Revision

  • Added reference design link to navigation bar at the top of the front pageGo
  • Changed body size from 18.00 mm × 18.00 mm to 2.90 mm × 1.60 mm in Device Information tableGo
  • Changed pin numbers in pin functions table to match pin configuration figureGo
  • Changed Absolute Maximum Ratings table for clarity; no values were changed Go
  • Changed Recommended Operating Conditions table; moved some content from Electrical Characteristics table, but no values changedGo
  • Changed all values in Thermal Information tableGo
  • Changed Electrical Characteristics table; reformatted for clarity; moved some content to Recommended Operating Conditions table, and deleted duplicate contentGo
  • Changed common-mode rejection test conditions to better highlight each device in Electrical Characteristics table Go
  • Changed offset voltage vs temperature to offset voltage drift in Electrical Characteristics tableGo
  • Changed offset voltage vs power supply test conditions to better highlight each device in Electrical Characteristics tableGo
  • Changed reference in text from Figure 10 to Figure 11 in last paragraph of Selecting the Shunt Resistor and RL sectionGo

Changes from C Revision (November 2005) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go