SBOSA31B February   2023  – March 2024 INA241A-Q1 , INA241B-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Amplifier Input Common-Mode Signal
        1. 7.3.1.1 Enhanced PWM Rejection Operation
        2. 7.3.1.2 Input-Signal Bandwidth
        3. 7.3.1.3 Low Input Bias Current
        4. 7.3.1.4 Low VSENSE Operation
        5. 7.3.1.5 Wide Fixed Gain Output
        6. 7.3.1.6 Wide Supply Range
    4. 7.4 Device Functional Modes
      1. 7.4.1 Adjusting the Output With the Reference Pins
      2. 7.4.2 Reference Pin Connections for Unidirectional Current Measurements
        1. 7.4.2.1 Ground Referenced Output
        2. 7.4.2.2 VS Referenced Output
      3. 7.4.3 Reference Pin Connections for Bidirectional Current Measurements
        1. 7.4.3.1 Output Set to External Reference Voltage
        2. 7.4.3.2 Output Set to Mid-Supply Voltage
        3. 7.4.3.3 Output Set to Mid-External Reference
        4. 7.4.3.4 Output Set Using Resistor Divider
      4. 7.4.4 High Signal Throughput
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 RSENSE and Device Gain Selection
    2. 8.2 Typical Application
      1. 8.2.1 Inline Motor Current-Sense Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (August 2023) to Revision B (March 2024)

  • Updated the number format for tables, figures, and cross-references throughout the documentGo
  • Deleted the preview note from D package from Package Information table and throughout the data sheetGo
  • Deleted the preview note about D package informationGo

Changes from Revision * (February 2023) to Revision A (August 2023)

  • Added the DGS package to the data sheetGo
  • Changed package information from body size to package sizeGo
  • Deleted preview note from DGK package from package information tableGo
  • Added the DGS package pin configurationGo
  • Added DGS package in recommended layout examplesGo