This device is specified for current handling of up to 10 A over the entire –40°C to +125°C temperature range using a 1-oz copper pour for the input power plane, as well as no external airflow passing over the device.
The primary current-handling limitation for this device is how much heat is dissipated inside the package. Efforts to improve heat transfer out of the package and into the surrounding environment improve the ability of the device to handle currents of up to 15 A over the entire –40°C to +125°C temperature range.
Heat transfer improvements primarily involve larger copper power traces and planes with increased copper thickness (2 oz), as well as providing airflow to pass over the device. The INA253 evaluation module (EVM) features a 2-oz copper pour for the planes, and is capable of supporting 15 A at temperatures up to 125°C.
Place the power-supply bypass capacitor as close as possible to the supply and ground pins. The recommended value of this bypass capacitor is 0.1 µF. Additional decoupling capacitance can be added to compensate for noisy or high-impedance power supplies.